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The TE0817-02-7DI81-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 SDRAM. The module features a compact form factor suitable for space-constrained designs and supports high-speed interfaces including DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0. It operates within an industrial temperature range of -40°C to +85°C, ensuring reliability in demanding environments.
Verify current availability status directly with Trenz Electronic or authorized distributors, as supply situations for specific module configurations may vary. Confirm that the ordering suffix corresponds to the required processor speed grade and memory configuration. Ensure compatibility with selected baseboards before procurement. Request updated lifecycle notifications to manage long-term production plans effectively.
Select this module when a compact form factor is required alongside significant FPGA resources and ARM processing power. Consider the available interface options such as DisplayPort and SATA for direct connectivity needs. Evaluate thermal management requirements based on the specific workload and enclosure constraints. Verify pinout compatibility with existing carrier board designs to minimize redesign efforts.
Trenz Electronic specializes in developing modular systems based on Xilinx and AMD FPGAs and SoCs. The TE0817 series represents their offerings utilizing the Zynq UltraScale+ architecture, providing a balance of processing performance and programmability. These modules are part of a broader ecosystem that includes compatible baseboards and development tools, facilitating rapid prototyping and deployment in industrial and automotive sectors.
Consult official Trenz Electronic documentation for confirmed substitute parts within the same product family. Verify that any replacement maintains identical pinout compatibility and electrical characteristics. Check for changes in processor speed grades or memory capacities that might affect system performance. Ensure that software drivers and BSP support remain available for the alternative component.