TE0817-02-7DI81-A

TE0817-02-7DI81-A

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-

SKU:0699eaaec82d Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
  • Operating Temperature:-

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TE0817-02-7DI81-A

Overview

The TE0817-02-7DI81-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 SDRAM. The module features a compact form factor suitable for space-constrained designs and supports high-speed interfaces including DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0. It operates within an industrial temperature range of -40°C to +85°C, ensuring reliability in demanding environments.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC for combined processing and programmable logic capabilities
  • Supports multiple high-speed peripheral interfaces including PCIe, SATA, and USB 3.0
  • Industrial-grade operational temperature range for robust performance in harsh conditions

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-bandwidth data acquisition
  • Automotive infotainment and instrument cluster displays
  • Telecommunications infrastructure equipment
  • Test and measurement instrumentation

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply situations for specific module configurations may vary. Confirm that the ordering suffix corresponds to the required processor speed grade and memory configuration. Ensure compatibility with selected baseboards before procurement. Request updated lifecycle notifications to manage long-term production plans effectively.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA resources and ARM processing power. Consider the available interface options such as DisplayPort and SATA for direct connectivity needs. Evaluate thermal management requirements based on the specific workload and enclosure constraints. Verify pinout compatibility with existing carrier board designs to minimize redesign efforts.

Part Context

Trenz Electronic specializes in developing modular systems based on Xilinx and AMD FPGAs and SoCs. The TE0817 series represents their offerings utilizing the Zynq UltraScale+ architecture, providing a balance of processing performance and programmability. These modules are part of a broader ecosystem that includes compatible baseboards and development tools, facilitating rapid prototyping and deployment in industrial and automotive sectors.

Replacement Considerations

Consult official Trenz Electronic documentation for confirmed substitute parts within the same product family. Verify that any replacement maintains identical pinout compatibility and electrical characteristics. Check for changes in processor speed grades or memory capacities that might affect system performance. Ensure that software drivers and BSP support remain available for the alternative component.

TE0817-02-7DI81-ATE0817-02-7DI81-A

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