TE0818-01-6BE21-A

Overview

The TE0818-01-6BE21-A is a System-on-Module manufactured by Trenz Electronic, part of the UltraSOM+ family. It integrates an AMD Zynq UltraScale+ MPSoC to provide combined processing and programmable logic capabilities. The module includes onboard memory components such as DDR4 SDRAM and QSPI flash for system boot and data storage. Designed for compact embedded applications, it utilizes a high-density connector interface to expose processor peripherals, ensuring reliable operation in industrial and commercial environments.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual ARM Cortex-A53 processors and FPGA fabric
• Includes onboard DDR4 SDRAM and non-volatile flash memory for standalone operation
• Compact form factor designed for space-constrained embedded systems
• Supports high-speed peripheral interfaces via dedicated expansion connectors

Applications

• Industrial automation controllers requiring real-time processing
• Medical imaging devices needing low-latency signal processing
• Automotive infotainment and instrument cluster displays
• Portable test and measurement equipment
• Smart infrastructure edge computing nodes

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as lead times may vary based on production schedules. Confirm that the specific suffix matches required memory configurations and temperature grades. Request updated datasheets and mechanical drawings to ensure compatibility with existing carrier board designs before finalizing procurement orders.

Selection Notes

Select this module when a combination of hard processor system performance and flexible FPGA logic is required within a small footprint. Evaluate memory requirements against the onboard DDR4 and flash capacities. Ensure the host baseboard supports the specific pinout and power delivery specifications defined in the UltraSOM+ technical documentation.

Part Context

This component belongs to the Trenz Electronic UltraSOM+ product line, which focuses on high-performance SoC modules based on AMD Xilinx technology. The series is engineered for scalability across various application domains, offering standardized interfaces to simplify integration into custom carrier boards while maintaining robust thermal and electrical performance standards.

Replacement Considerations

No direct public substitutes are confirmed. Consider other modules from the same UltraSOM+ family with different processor densities or memory configurations if functional requirements change. Verify mechanical and electrical compatibility before transitioning to alternative SKUs.