TE0818-01-9BE21-A

TE0818-01-9BE21-A

$1,082.06
  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™

SKU:f3b64d104c55 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0818-01-9BE21-A

Overview

The TE0818-01-9BE21-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with quad-core ARM Cortex-A53 and dual-core Cortex-R5 processors. The module includes integrated DDR4 memory and supports multiple high-speed interfaces, enabling complex processing tasks in compact form factors suitable for industrial and communication systems.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and R5 cores
  • Supports high-speed peripheral interfaces including PCIe and USB 3.0
  • Includes on-board DDR4 SDRAM for data processing
  • Designed for UltraSOM+ compatible carrier boards

Applications

  • Industrial automation and control systems
  • Medical imaging devices
  • Telecommunications infrastructure equipment
  • Automotive infotainment and cockpit displays

Procurement Notes

Verify component availability status as supply chain conditions may vary. Confirm that the specific suffix indicates the correct memory configuration and interface options required for your design. Ensure compatibility with the designated UltraSOM+ basis board before procurement. Check for any end-of-life notifications or discontinuation notices from the manufacturer to plan for long-term production needs.

Selection Notes

Select this module when a combined FPGA and processor solution is required within a small footprint. Consider the thermal performance requirements of the Zynq UltraScale+ MPSoC under load. Verify that the carrier board provides sufficient power delivery and signal integrity for the high-speed interfaces supported by the SOM. Evaluate the software support ecosystem provided by Trenz Electronic for Linux and bare-metal development.

Part Context

This part belongs to the Trenz Electronic UltraSOM+ family, which utilizes standard SoM form factors to simplify integration into custom carrier designs. The TE0818 series specifically targets applications requiring significant computational power and I/O flexibility. It serves as a core computing element for developers needing to accelerate algorithms using FPGA fabric while running complex operating systems on the ARM processors.

TE0818-01-9BE21-ATE0818-01-9BE21-A
$1,082.06
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