TE0818-01-9GI21-A

TE0818-01-9GI21-A

$1,368.51
  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™

SKU:70921a83b188 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC MODULE WITH ZYNQ
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0818-01-9GI21-A

Overview

The TE0818-01-9GI21-A is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ RFSoC device, combining programmable logic with ARM Cortex-A53 and Cortex-R5F processors. The module features integrated RF data converters and substantial memory resources to support complex signal processing tasks.

Feature Summary

  • Integrates AMD Zynq UltraScale+ RFSoC FPGA technology
  • Combines programmable logic with dual-core ARM Cortex-A53 and dual-core Cortex-R5F processors
  • Includes on-chip RF analog-to-digital and digital-to-analog converters
  • Designed for compact UltraSOM+ form factor compatibility

Applications

  • Software-defined radio systems
  • Advanced radar and electronic warfare platforms
  • High-speed test and measurement equipment
  • Medical imaging systems requiring real-time signal processing

Procurement Notes

Verify current availability status as this component may be subject to discontinuation or limited supply constraints. Confirm RoHS compliance details through official manufacturer documentation prior to integration. Ensure that the specific suffix indicates the correct memory configuration and package variant required for the design.

Selection Notes

Select this module when RF conversion capabilities are required alongside general-purpose processing. Compare against standard MPSoC variants if RF functionality is unnecessary to optimize cost. Validate thermal management requirements due to the high density of the RFSoC architecture within the small form factor.

Part Context

This part belongs to the Trenz Electronic TE0818 UltraSOM+ family, which utilizes AMD Xilinx Zynq UltraScale+ devices. These modules are engineered for rugged environments and offer extended temperature ranges. The TE0818 series specifically targets applications demanding high throughput and low latency in both digital and analog domains.

TE0818-01-9GI21-ATE0818-01-9GI21-A
$1,368.51
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