TE0818-01-9GI21-AK

TE0818-01-9GI21-AK

$1,430.56
  • Description:ULTRASOM+ MPSOC-MODUL WITH ZYNQ
  • Series:Zynq® UltraScale+™

SKU:c7383f097738 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC-MODUL WITH ZYNQ
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket - 240
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0818-01-9GI21-AK

Overview

The TE0818-01-9GI21-AK is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Zynq UltraScale+ RFSoC device, combining programmable logic with processing systems and integrated RF capabilities. The module includes 9 GB of DDR4 memory operating at 2666 MT/s to support data-intensive workloads. This SOM architecture enables compact designs requiring significant computational power and analog-to-digital conversion within a standardized form factor.

Feature Summary

  • Integrates AMD Zynq UltraScale+ RFSoC FPGA technology
  • Includes 9 GB DDR4-2666 memory subsystem
  • Combines programmable logic with ARM processing cores
  • Supports direct RF signal acquisition and processing

Applications

  • Software-defined radio systems
  • High-speed data acquisition platforms
  • Advanced radar signal processing
  • Medical imaging front-ends

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply conditions. Confirm compatibility with baseboard designs through official mechanical drawings and electrical schematics provided by Trenz Electronic. Ensure that the required software development tools match the specific silicon revision and memory configuration of the unit.

Selection Notes

Select this module when application requirements demand high-throughput RF sampling combined with flexible digital signal processing. Compare against standard Zynq MPSoC modules if RF front-end integration is not necessary. Evaluate thermal management solutions suitable for the specific package and power dissipation characteristics of the UltraScale+ RFSoC device.

Part Context

This component belongs to the Trenz Electronic SOM family utilizing AMD Xilinx silicon. It serves as a complete computing solution on a module, reducing design complexity for OEMs. The product line focuses on providing validated hardware platforms for rapid prototyping and production deployment in industrial and scientific sectors.

TE0818-01-9GI21-AKTE0818-01-9GI21-AK
$1,430.56
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