TE0818-02-9BE81-A

Overview

The TE0818-02-9BE81-A is a baseboard accessory manufactured by Trenz Electronic, designed specifically for the TE081X UltraSOM+ System-on-Module family. This component serves as a carrier platform to facilitate the integration of UltraITX+ form factor modules into custom or reference designs. It provides necessary interconnects and power distribution infrastructure required for the operation of the associated SOM.

Feature Summary

• Designed as a basis board for Trenz Electronic TE081X UltraSOM+ modules
• Supports UltraITX+ module form factor integration
• Functions as a modular system accessory for embedded solutions

Applications

• Development and prototyping of systems utilizing TE081X UltraSOM+
• Integration of AMD UltraScale+ RFSoC FPGA modules
• Creation of custom carrier boards based on standard UltraITX+ footprint

Procurement Notes

Verify current availability status as the product lifecycle may be discontinued. Confirm compatibility with specific TE081X module variants before procurement. Check for official documentation updates regarding mechanical dimensions and pinout definitions to ensure proper integration with the target SOM.

Selection Notes

Select this baseboard only when using Trenz Electronic TE081X UltraSOM+ modules requiring an UltraITX+ interface. Ensure the design requirements align with the electrical and mechanical specifications provided in the official datasheet. Consider thermal management solutions if high-performance SOMs are utilized.

Part Context

This part belongs to the Trenz Electronic embedded solutions portfolio, specifically within the module accessories category. It complements the TE081X series of System-on-Modules, which typically feature high-performance FPGAs such as AMD UltraScale+ devices. The baseboard enables developers to leverage these modules without designing a custom carrier from scratch.