TE0818-02-9GI81-AK

TE0818-02-9GI81-AK

$1,430.56
  • Description:ULTRASOM+ MPSOC-MODULE WITH AMD
  • Series:-

SKU:b5d01f9b7e48 Category: Brand:

  
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Product Detailed Parameters

  • Description:ULTRASOM+ MPSOC-MODULE WITH AMD
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA
  • Core Processor:Zynq UltraScale+ XCZU9EG-2FFVC900I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) 4 x 240 Pin
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0818-02-9GI81-AK

Overview

The TE0818-02-9GI81-AK is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD/Xilinx Zynq UltraScale+ RFSoC device, combining programmable logic with ARM Cortex-A53 and Cortex-R5F processors. The module features integrated RF transceivers and high-speed ADC/DAC interfaces, making it suitable for complex signal processing tasks in demanding industrial and communication environments.

Feature Summary

  • Integrates AMD/Xilinx Zynq UltraScale+ RFSoC architecture
  • Combines FPGA fabric with quad-core ARM Cortex-A53 processors
  • Includes integrated high-speed analog-to-digital and digital-to-analog converters
  • Supports direct RF sampling and advanced signal processing capabilities

Applications

  • Software-defined radio systems
  • Advanced radar and electronic warfare systems
  • High-speed data acquisition and test equipment
  • Telecommunications infrastructure base stations

Procurement Notes

Verify current availability status as the product lifecycle may be discontinued or restricted. Confirm compatibility with specific carrier boards and ensure that all necessary development tools and licenses are available for the integrated RFSoC platform before procurement.

Selection Notes

Select this module when high-density RF processing and mixed-signal capabilities are required within a compact form factor. Ensure that the design supports the thermal requirements of the RFSoC and that the host system provides adequate power delivery for the integrated memory and processor cores.

Part Context

This component belongs to the Trenz Electronic TE0818 family of UltraSOM+ modules. These modules are engineered for rugged industrial use and offer a standardized interface for easy integration into custom carrier designs. The family focuses on leveraging Xilinx's latest SoC technologies for scalable performance.

Replacement Considerations

No publicly confirmed direct substitutes are available. Alternative solutions require evaluating other RFSoC-based SOMs from different manufacturers, ensuring pin compatibility and software ecosystem support.

TE0818-02-9GI81-AKTE0818-02-9GI81-AK
$1,430.56
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