TE0818-02-BBE81-A

Overview

The Trenz Electronic TE0818-02-BBE81-A is an industrial-grade System-on-Module integrating an AMD Zynq UltraScale+ MPSoC (ZU6/ZU9/ZU15) in a compact 76 mm x 52 mm form factor. It features up to 4 GByte of DDR4 SDRAM with a 64-bit data bus and dual 64 MByte Quad SPI Flash memory for configuration. The module provides extensive I/O via four rugged board-to-board connectors, supporting up to 204 programmable logic I/Os, 65 PS MIOs, and multiple high-speed transceivers.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with configurable processing system and programmable logic domains
• Supports flexible power management with independent enable signals for low-power, full-power, and transceiver domains
• Includes onboard clock generation with selectable PLL sources and integrated temperature sensing diodes
• Features rugged board-to-board stacking connectors for high-speed serial transceiver and general-purpose I/O access

Applications

• Industrial automation and control systems requiring robust FPGA-based processing
• High-performance embedded computing platforms utilizing mixed-signal processing capabilities
• Test and measurement equipment needing precise timing and high-speed data acquisition interfaces
• Aerospace and defense applications demanding extended temperature range operation

Procurement Notes

Verify the specific assembly options and power supply requirements against the technical reference manual before integration. Confirm that the baseboard design supports the recommended current ratings for the low-power, full-power, and transceiver domains. Ensure compatibility with the required boot mode selection and JTAG debugging interfaces as defined in the controller signal specifications.

Selection Notes

Select this module when a compact industrial SOM with high I/O density and flexible power domain control is required. Consider the available DDR4 capacity and flash configuration options during the initial design phase. Evaluate the thermal solution needs based on the maximum power consumption of the chosen SoC speedgrade and engine type. Verify that the carrier board can accommodate the specified connector stacking heights and mechanical dimensions.

Part Context

This component belongs to the TE0818 series of UltraSOM+ modules from Trenz Electronic. These modules are designed to leverage the capabilities of AMD Zynq UltraScale+ MPSoCs, providing a complete computing solution in a small footprint. The series supports various assembly options to tailor memory and peripheral configurations for specific application needs.

Replacement Considerations

No public confirmed substitutes are identified in the provided documentation. As this is a specialized industrial module, direct replacements may require significant redesign of the carrier board and software stack due to unique connector pinouts and power sequencing requirements.