TE0820-02-02CG-1EA

TE0820-02-02CG-1EA

  • Description:IC MODULE ZYNQ USCALE 1GB 128MB
  • Series:TE0820

SKU:a49e89efecf7 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 1GB 128MB
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:1GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0820-02-02CG-1EA

Overview

The TE0820-02-02CG-1EA is a System-on-Module integrating the Xilinx Zynq UltraScale+ ZU3EG MPSoC. It features a dual-core Cortex-A53 APU and dual Cortex-R5 RPU. The module includes 1 GByte of 32-bit DDR4 SDRAM, 4 GByte eMMC, and dual 256 Mbit Quad SPI flash. Connectivity comprises Gigabit Ethernet via Marvell Alaska 88E1512, USB 2.0 ULPI, four GTR transceivers, and I/Os routed through high-speed B2B connectors.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ ZU3EG with dual Cortex-A53 and dual Cortex-R5 cores
  • Includes on-board 1 GB DDR4, 4 GB eMMC, and dual SPI flash for boot and storage
  • Features integrated Gigabit Ethernet PHY and USB 2.0 ULPI controller
  • Provides four GTR transceivers and extensive programmable logic I/Os

Applications

  • Industrial automation controllers requiring real-time processing
  • Embedded vision systems utilizing FPGA parallel logic
  • High-speed data acquisition platforms
  • Network infrastructure edge devices

Procurement Notes

Verify component availability as this specific variant may be discontinued or subject to limited supply status. Confirm mechanical compatibility with carrier boards designed for the standard 4 x 5 cm form factor. Ensure power delivery meets the minimum 3A requirement for system startup. Review the latest Technical Reference Manual for any hardware revision updates affecting pin mappings or power sequencing.

Selection Notes

Select this module when a compact solution combining ARM processing and FPGA flexibility is required. The ZU3EG provides sufficient resources for moderate complexity designs. Verify that the 1 GB DDR4 capacity meets application memory demands. Check if the default PS MIO mapping aligns with interface requirements for Ethernet, USB, and storage.

Part Context

This module belongs to the Trenz Electronic TE0820 series, which utilizes the 4 x 5 cm standard footprint. It is part of their MPSoC product line targeting embedded applications. The series offers mechanical compatibility across variants while differing in processor core counts and memory configurations.

Replacement Considerations

Consult the manufacturer's discontinuation notifications for confirmed substitutes. Alternative modules within the TE0820 family may offer different processor options like the ZU5EV. Evaluate carrier board redesign efforts if switching to non-compatible form factors.

TE0820-02-02CG-1EATE0820-02-02CG-1EA

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