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The TE0820-02-02CG-1EA is a System-on-Module integrating the Xilinx Zynq UltraScale+ ZU3EG MPSoC. It features a dual-core Cortex-A53 APU and dual Cortex-R5 RPU. The module includes 1 GByte of 32-bit DDR4 SDRAM, 4 GByte eMMC, and dual 256 Mbit Quad SPI flash. Connectivity comprises Gigabit Ethernet via Marvell Alaska 88E1512, USB 2.0 ULPI, four GTR transceivers, and I/Os routed through high-speed B2B connectors.
Verify component availability as this specific variant may be discontinued or subject to limited supply status. Confirm mechanical compatibility with carrier boards designed for the standard 4 x 5 cm form factor. Ensure power delivery meets the minimum 3A requirement for system startup. Review the latest Technical Reference Manual for any hardware revision updates affecting pin mappings or power sequencing.
Select this module when a compact solution combining ARM processing and FPGA flexibility is required. The ZU3EG provides sufficient resources for moderate complexity designs. Verify that the 1 GB DDR4 capacity meets application memory demands. Check if the default PS MIO mapping aligns with interface requirements for Ethernet, USB, and storage.
This module belongs to the Trenz Electronic TE0820 series, which utilizes the 4 x 5 cm standard footprint. It is part of their MPSoC product line targeting embedded applications. The series offers mechanical compatibility across variants while differing in processor core counts and memory configurations.
Consult the manufacturer's discontinuation notifications for confirmed substitutes. Alternative modules within the TE0820 family may offer different processor options like the ZU5EV. Evaluate carrier board redesign efforts if switching to non-compatible form factors.