TE0820-02-02EG-1EA

Overview

The TE0820-02-02EG-1EA is a System-on-Module integrating an AMD Zynq UltraScale+ ZU3EG MPSoC in a 784-pin package. It features dual-core Cortex-A53 and dual Cortex-R5 processors, alongside programmable logic with 132 HP I/Os. The module includes 1 GByte of 32-bit DDR4 SDRAM, 4 GByte eMMC, and dual SPI flash. Interfaces include Gigabit Ethernet via Marvell Alaska 88E1512, USB 2.0 ULPI, four GTR transceivers, and DisplayPort. Operating temperature ranges from -40°C to +105°C.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ ZU3EG MPSoC with quad-core or dual-core ARM A53 and dual RPU cores.
• Includes on-board peripherals such as Gigabit Ethernet PHY, USB 2.0 ULPI PHY, and eMMC storage.
• Features a Lattice MachXO2 System Controller CPLD for power management and boot control.
• Provides high-speed serial interfaces including PCIe, SATA, and DisplayPort via GTR transceivers.

Applications

• Industrial automation and embedded control systems
• High-speed data acquisition and processing
• Medical imaging and diagnostic equipment
• Automotive infotainment and instrument clusters

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and revision status. Ensure carrier board designs comply with the mechanical mating height and electrical specifications defined in the Technical Reference Manual. Confirm that the required memory configuration matches the delivered unit, as variants may differ in RAM and storage capacity.

Selection Notes

Select this module when a compact 4x5 cm form factor is required with integrated MPSoC capabilities. The ZU3EG variant offers a balance of processing performance and I/O density. Consider the available GTR lanes for high-speed serial applications and verify that the on-board peripherals like Ethernet and USB meet the system interface requirements without additional external components.

Part Context

This component belongs to the Trenz Electronic TE0820 family of System-on-Modules designed for the 4x5 cm standard footprint. These modules are engineered for high reliability in industrial environments and are mechanically compatible with other modules in the same series. They provide a complete computing solution with integrated power management and memory, simplifying carrier board design.

Replacement Considerations

Check for updated revisions within the TE0820 series that may offer different processor options or memory configurations. Verify compatibility with existing carrier boards if substituting with other TE0820 variants. Consult the manufacturer for end-of-life notifications or recommended alternative modules if the specific ZU3EG configuration is discontinued.

FAQ

What is the default boot source for the TE0820-02?

The module can boot from either QSPI Flash or SD Card, determined by the state of the MODE pin on the B2B connector JM1. Low selects SD Card boot, while High selects Flash boot.

How is JTAG access managed on the module?

JTAG access is controlled by the JTAGEN pin on connector JM1. Pulling it low routes JTAG to the Zynq MPSoC, while pulling it high routes it to the System Controller CPLD.

What is the maximum voltage for the HP I/O banks?

The High Performance (HP) I/O banks (64, 65, and 66) support a maximum voltage of 1.8V.