TE0820-02-03EG-1EA

Overview

The TE0820-02-03EG-1EA is a System-on-Module integrating an AMD Zynq UltraScale+ ZU3EG MPSoC. It features a dual-core Cortex-A53 APU and dual Cortex-R5 RPU. The module includes 1 GByte of 32-bit DDR4 SDRAM, 4 GByte eMMC, and dual SPI flash memory. Interfaces include Gigabit Ethernet via Marvell Alaska 88E1512, USB 2.0 ULPI, PCIe, SATA, DisplayPort, and four GTR transceivers. Operating temperature range is -40°C to +85°C.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ ZU3EG with dual Cortex-A53 and dual Cortex-R5 processors
• Includes on-board power management with switch-mode regulators for all internal voltages
• Features rugged high-speed stacking strip connectors for board-to-board interfacing
• Provides integrated Gigabit Ethernet PHY and Hi-speed USB 2.0 ULPI transceiver

Applications

• Industrial automation and control systems
• High-speed data acquisition platforms
• Embedded digital signal processing applications
• Automotive infotainment and instrumentation

Procurement Notes

Verify the specific ordering suffix against the current Trenz Electronic product catalog to confirm availability and revision status. As this model may be discontinued or superseded by newer variants within the TE0820 family, consult official distributor channels for current supply chain information. Ensure compatibility with carrier boards designed for the standard 4 x 5 cm form factor.

Selection Notes

Select this module when a compact solution requiring both ARM application cores and real-time processing is needed. The ZU3EG variant offers a balance of performance and pin count suitable for moderate I/O requirements. Consider the available memory configurations if higher storage capacity than the default 1 GByte DDR4 is required for complex designs.

Part Context

This component belongs to the TE0820 series of System-on-Modules manufactured by Trenz Electronic GmbH. These modules are designed for the 4 x 5 cm footprint, ensuring mechanical compatibility across the series. The TE0820 line specifically targets applications leveraging AMD Xilinx Zynq UltraScale+ MPSoC technology for embedded computing tasks.

Replacement Considerations

Check the TE0820 TRM for currently in-production variants that may offer updated components or enhanced specifications. Verify mechanical and electrical compatibility with existing carrier boards before substituting. Consult Trenz Electronic documentation for any Product Change Notifications affecting pinouts or peripheral selections.