TE0820-03-03CG-1EA

Overview

The Trenz Electronic TE0820-03-03CG-1EA is an industrial-grade System-on-Module integrating the AMD Zynq UltraScale+ XCZU4EV-1SFVC784E processor. It features a dual-core Cortex-R5 and quad-core Cortex-A53 architecture with 2 GByte of 32-bit DDR4 SDRAM and 128 MByte QSPI flash memory. The module supports DisplayPort, PCIe, SATA, USB 3.0, and GMII interfaces within a 40 mm x 50 mm form factor.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and Cortex-R5 processors
• Includes on-board Gigabit Ethernet PHY and high-speed USB ULPI transceiver
• Features programmable clock generator for flexible system timing
• Provides rugged high-speed stacking strip connectors for carrier board integration

Applications

• Industrial automation controllers requiring real-time processing
• Medical imaging devices utilizing high-speed data acquisition
• Automotive infotainment systems with display output requirements
• Telecommunications infrastructure equipment

Procurement Notes

Verify component availability through authorized distributors as supply status may vary. Confirm specific ordering suffixes match required processor variants and memory configurations. Review technical documentation for mechanical compatibility with target carrier boards. Ensure environmental specifications meet operational temperature requirements.

Selection Notes

Select this module for applications demanding high-performance computing in a compact footprint. The integrated peripherals reduce external component count. Consider thermal management solutions due to power density. Evaluate interface requirements against available B2B connector signals. Verify software support for the specific processor variant.

Part Context

This module belongs to the TE0820 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are mechanically compatible across the series, allowing for scalable design transitions. The TE0820 platform targets embedded applications requiring FPGA flexibility combined with ARM processing capabilities.

Replacement Considerations

No public confirmed substitutes are identified in the provided documentation. Designers should evaluate mechanical and electrical compatibility when considering alternative modules from other manufacturers.