TE0820-03-03EG-1ED

Overview

The Trenz Electronic TE0820-03-03EG-1ED is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU3EG-1E MPSoC. It features a dual-core Cortex-A53 application processor and dual Cortex-R5 real-time processors. The module includes 2 GByte of 32-bit DDR4 SDRAM, 128 MByte QSPI flash for boot configuration, and 8 GByte eMMC storage. Connectivity options include Gigabit Ethernet via Marvell Alaska 88E1512 PHY, USB 3.0 with ULPI transceiver, DisplayPort, PCIe, SATA, and four high-speed serial I/O interfaces.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and Cortex-R5 processing units
• Includes on-board power management, DDR4 memory, and non-volatile storage solutions
• Provides rugged high-speed stacking strip connectors for board-to-board interfacing
• Features integrated Gigabit Ethernet PHY and high-speed USB 2.0/3.0 support

Applications

• Industrial automation and control systems
• High-speed data acquisition and measurement devices
• Embedded digital signal processing applications
• Automotive industry embedded systems
• PC-based process control and monitoring

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product portfolio to confirm availability and revision status. As this component may be subject to discontinuation or lifecycle changes, consult official distributor channels for current production status. Ensure compatibility with carrier board designs regarding mechanical form factor and electrical interface requirements before procurement.

Selection Notes

Select this module when a compact 4 x 5 cm form factor is required alongside significant processing power from the Zynq UltraScale+ architecture. It is suitable for designs needing integrated peripherals such as Gigabit Ethernet and USB without external PHY components. Consider the available memory configurations and I/O mapping constraints defined in the technical reference manual during system architecture planning.

Part Context

This module belongs to the TE0820 series by Trenz Electronic, designed for the 4 x 5 cm form factor. The series targets industrial and automotive applications requiring robust FPGA and SoC capabilities. Trenz Electronic specializes in development services and turnkey designs for embedded systems based on FPGA and CPU architectures, offering comprehensive engineering support.

Replacement Considerations

Check for other variants within the TE0820 family that may use different Zynq UltraScale+ chips (e.g., XCZU2CG or XCZU4EV) if performance or pinout differences are acceptable. Verify mechanical compatibility with existing carrier boards, as all modules in the 4 x 5 cm series share the same footprint but may have distinct electrical characteristics.