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The Trenz Electronic TE0820-03-2AI21FA is an industrial-grade System on Module (SoM) with a 50 x 40 mm form factor. It integrates a Xilinx Zynq UltraScale+ XCZU2CG MPSoC, featuring a dual-core Cortex-A53 and dual Cortex-R5 processor. The module includes 2 GByte of 32-bit DDR4 SDRAM, 128 MByte QSPI flash memory, and 8 GByte eMMC storage. Connectivity options include Gigabit Ethernet via Marvell Alaska 88E1512, USB 3.0, DisplayPort, PCIe, SATA, and four high-speed serial GMII interfaces.
Verify the specific ordering suffix against the manufacturer's current documentation to confirm the exact processor variant and memory configuration. Confirm mechanical compatibility with carrier boards utilizing standard 4x5 cm SoM footprints. Ensure that the required boot mode settings align with the default CPLD firmware state provided in the initial delivery.
Select this module when a compact industrial solution requiring both programmable logic and application processing is needed. The TE0820-03 series supports multiple Zynq UltraScale+ variants; verify that the XCZU2CG device meets the specific performance and I/O requirements of the target design. Consider the available B2B connector pinout for interface integration.
This component belongs to the Trenz Electronic TE0820 family of 4x5 cm System on Modules designed for Xilinx Zynq UltraScale+ MPSoCs. These modules are engineered for high reliability in demanding environments, offering a standardized footprint compatible with various carrier board designs from Trenz Electronic and third-party manufacturers.
Consult the official Trenz Electronic documentation for confirmed alternative part numbers within the TE0820 series that utilize different Zynq UltraScale+ devices or memory configurations. Verify mechanical and electrical compatibility before substituting.