TE0820-03-2AI21FA

TE0820-03-2AI21FA

  • Description:MOD MPSOC
  • Series:TE0820

SKU:793ae07d8fe3 Category: Brand:

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Product Detailed Parameters

  • Description:MOD MPSOC
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2CG-1SFVC784I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0820-03-2AI21FA

Overview

The Trenz Electronic TE0820-03-2AI21FA is an industrial-grade System on Module (SoM) with a 50 x 40 mm form factor. It integrates a Xilinx Zynq UltraScale+ XCZU2CG MPSoC, featuring a dual-core Cortex-A53 and dual Cortex-R5 processor. The module includes 2 GByte of 32-bit DDR4 SDRAM, 128 MByte QSPI flash memory, and 8 GByte eMMC storage. Connectivity options include Gigabit Ethernet via Marvell Alaska 88E1512, USB 3.0, DisplayPort, PCIe, SATA, and four high-speed serial GMII interfaces.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and Cortex-R5 processing units
  • Includes onboard power management, DDR4 SDRAM, and non-volatile storage solutions
  • Provides rugged high-speed stacking strip connectors for board-to-board I/O expansion
  • Features integrated Gigabit Ethernet PHY and high-speed USB ULPI transceiver

Applications

  • Industrial automation and control systems
  • Medical imaging and diagnostic equipment
  • Aerospace and defense avionics
  • Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to confirm the exact processor variant and memory configuration. Confirm mechanical compatibility with carrier boards utilizing standard 4x5 cm SoM footprints. Ensure that the required boot mode settings align with the default CPLD firmware state provided in the initial delivery.

Selection Notes

Select this module when a compact industrial solution requiring both programmable logic and application processing is needed. The TE0820-03 series supports multiple Zynq UltraScale+ variants; verify that the XCZU2CG device meets the specific performance and I/O requirements of the target design. Consider the available B2B connector pinout for interface integration.

Part Context

This component belongs to the Trenz Electronic TE0820 family of 4x5 cm System on Modules designed for Xilinx Zynq UltraScale+ MPSoCs. These modules are engineered for high reliability in demanding environments, offering a standardized footprint compatible with various carrier board designs from Trenz Electronic and third-party manufacturers.

Replacement Considerations

Consult the official Trenz Electronic documentation for confirmed alternative part numbers within the TE0820 series that utilize different Zynq UltraScale+ devices or memory configurations. Verify mechanical and electrical compatibility before substituting.

TE0820-03-2AI21FATE0820-03-2AI21FA

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