TE0820-03-2BE21FA

Overview

The TE0820-03-2BE21FA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC, specifically the XCZU5EV-1SFVC784I processor, providing combined FPGA and ARM processing capabilities. The module includes 2 GB of DDR4 SDRAM for system memory. It operates within an industrial temperature range from -40°C to +85°C and features a compact form factor measuring 50 mm x 40 mm.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5F processors alongside programmable logic fabric.
• Includes onboard 2 GB DDR4 SDRAM for high-bandwidth data handling.
• Supports diverse interface protocols including DisplayPort, PCIe, SATA, USB 3.0, GMII, QSPI, eMMC, I2C, JTAG, and Gigabit Ethernet.
• Designed for industrial environments with extended operating temperature specifications.

Applications

• Industrial automation and control systems requiring real-time processing.
• Medical imaging devices needing high-throughput data acquisition.
• Telecommunications infrastructure utilizing PCIe and Gigabit Ethernet interfaces.
• Automotive infotainment and instrument clusters leveraging DisplayPort output.

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply conditions. Confirm that the required pinout and mechanical dimensions match the target carrier board design. Ensure compliance with RoHS directives if applicable to the end product. Check for any recent Product Change Notifications (PCN) regarding component substitutions or manufacturing location changes.

Selection Notes

Select this module when a balance of FPGA flexibility and ARM processing power is required in a small footprint. Consider the TE0820 series variants if different processor speeds or memory capacities are needed. Evaluate the need for additional storage interfaces like eMMC or QSPI based on application boot requirements. Verify that the thermal solution supports the -40°C to +85°C operational range.

Part Context

This part belongs to the TE0820 family of SOMs from Trenz Electronic, which are built around AMD Xilinx Zynq UltraScale+ MPSoCs. These modules are designed to accelerate development cycles by providing a pre-validated hardware platform. The family offers various configurations differing primarily in the specific MPSoC device grade, memory size, and connector types, allowing customization for diverse performance and cost constraints.

Replacement Considerations

No direct public substitutes are confirmed for this exact configuration. Alternative solutions may involve other SOM vendors offering similar Zynq UltraScale+ platforms, but mechanical and electrical compatibility must be rigorously verified. If the specific XCZU5EV processor is unavailable, consider modules with higher or lower performance tiers within the same TE0820 family, such as those using ZU2EG or ZU3EG devices, noting potential software migration efforts.