TE0820-03-3BE21FA

Overview

The Trenz Electronic TE0820-03-3BE21FA is an industrial-grade System on Module integrating a Xilinx Zynq UltraScale+ MPSoC with dual Cortex-R5 and quad-core Cortex-A53 processors. It features 2 GByte of 32-bit DDR4 SDRAM, 128 MByte QSPI flash, and 8 GByte eMMC. The module includes a Marvell Alaska 88E1512 Gigabit Ethernet PHY, Microchip USB3320 ULPI transceiver, and Lattice MachXO2 CPLD for system control. Connectivity is provided via high-speed stacking strips supporting PCIe, SATA, DisplayPort, and USB 3.0 protocols.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with ARM Cortex-A53 and Cortex-R5 cores
• Includes onboard 2GB DDR4, 128MB QSPI, and 8GB eMMC memory
• Features integrated Gigabit Ethernet PHY and USB 2.0 ULPI transceiver
• Utilizes Lattice MachXO2 CPLD for system management and power sequencing

Applications

• Industrial automation controllers requiring real-time processing
• Medical imaging devices needing high-speed data acquisition
• Automotive infotainment systems utilizing display and connectivity interfaces
• Telecommunications infrastructure equipment
• Test and measurement instrumentation platforms

Procurement Notes

Verify the specific silicon variant (XCZU2CG/EG or XCZU3CG/EG) matches application requirements for core count and performance. Confirm that the carrier board design supports the required B2B connector mating height and electrical speed ratings. Ensure power supply rails align with the module's distribution dependencies and voltage levels. Check initial delivery state regarding CPLD firmware and flash programming status.

Selection Notes

Select this module when a compact 4x5 cm form factor is required alongside significant I/O bandwidth. Choose variants based on the necessary balance between processing power and thermal constraints. Consider the availability of optional assembly configurations for cost optimization. Verify compatibility with existing carrier board designs regarding mechanical dimensions and connector specifications.

Part Context

This module belongs to the Trenz Electronic TE0820 family of 4x5 cm SoMs designed for rugged environments. It leverages the Xilinx Zynq UltraScale+ architecture to combine programmable logic with processing subsystems. The platform emphasizes mechanical compatibility across the series while offering diverse peripheral integration options for embedded applications.

Replacement Considerations

Public confirmed substitutes are not available in the provided documentation. Replacement requires evaluating equivalent MPSoC modules from other manufacturers, ensuring pinout compatibility with existing carrier boards and verifying software migration efforts for the custom CPLD firmware and boot processes.