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The TE0820-04-2AI21FA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC processor, specifically the ZU2EG variant, paired with 2 GByte of DDR4 SDRAM. The module features a compact form factor measuring 40 mm by 50 mm. It supports a wide operating temperature range from -40°C to +85°C, ensuring reliability in industrial environments. Key interfaces include DisplayPort, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, and USB 3.0.
This component is officially listed as End-of-Life (EOL) by the manufacturer. Availability is restricted, and distributors may not stock this item in all regions. Engineers should verify current supply status through official channels before design finalization. Due to its discontinued status, long-term production support is not guaranteed. Early procurement or alternative sourcing strategies are recommended for ongoing projects.
Select this module when a ruggedized SOM with Zynq UltraScale+ ZU2EG capabilities is required. It is suitable for designs needing integrated DDR4 memory and diverse connectivity options within a small footprint. Consider the EOL status carefully; if long-term availability is critical, evaluate newer alternatives in the TE0820 family or other compatible SOMs that offer similar processing power and interface density without discontinuation risks.
The TE0820 series represents Trenz Electronic's line of modular systems based on Xilinx Zynq UltraScale+ MPSoCs. This specific model targets applications demanding both programmable logic and processing system integration. It serves as a building block for custom carrier boards, allowing developers to focus on application-specific logic rather than baseboard design complexities associated with bare SoCs.
As this part is discontinued, direct replacements must be sourced from the same product family or equivalent modules. Potential substitutes include other TE0820 variants with different processor speeds or memory configurations, provided they maintain pin compatibility or require minor carrier board adjustments. Verify functional equivalence regarding interface availability and thermal performance before transitioning.