TE0820-04-2BI21M

Overview

The Trenz Electronic TE0820-04-2BI21M is a System-on-Module integrating an AMD Xilinx Zynq UltraScale+ MPSoC (XCZU2EG-1E) with 2 GByte DDR4 SDRAM. It features a 4 x 5 cm form factor, industrial temperature range support, and on-board peripherals including eMMC, QSPI flash, Gigabit Ethernet, and USB 3.0 interfaces.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with Mali-400 GPU
• Includes dual DDR4 SDRAM and eMMC storage
• Features Lattice MachXO2 CPLD for system control
• Supports high-speed serial transceivers via B2B connectors

Applications

• Industrial automation controllers
• Medical imaging systems
• High-performance embedded computing
• Automotive infotainment units

Procurement Notes

Verify the specific ordering suffix against the official Trenz Electronic product matrix to confirm processor speed grade and memory configuration. Confirm current availability status as module variants may be subject to discontinuation or lifecycle changes.

Selection Notes

Select this module for applications requiring a compact 4x5cm footprint with high processing power. Ensure carrier board design supports the required voltage rails and utilizes the specified Samtec Razor Beam connectors for mechanical stability.

Part Context

This part belongs to the TE0820 series of System-on-Modules designed by Trenz Electronic. The series provides modular solutions based on Xilinx Zynq UltraScale+ technology, offering flexibility for various embedded computing requirements within a standardized form factor.

Replacement Considerations

Check for updated revisions within the TE0820 family that may offer different processor speed grades or memory capacities. Verify mechanical compatibility with existing carrier boards when considering alternative modules in the same series.