TE0820-04-3BE21FL

Overview

The TE0820-04-3BE21FL is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC, specifically the ZU2EG-1E variant, providing combined FPGA and ARM processor capabilities. The module includes 2 GByte of DDR4 SDRAM for high-speed data processing. It features a compact form factor measuring 40 mm by 50 mm, suitable for space-constrained designs. The component supports industrial operating temperatures ranging from -40°C to +85°C, ensuring reliability in demanding environments.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and programmable logic fabric
• Includes onboard 2 GByte DDR4 SDRAM for efficient memory management
• Supports diverse interface protocols including PCIe, SATA, USB 3.0, DisplayPort, and Ethernet via GMII
• Industrial temperature rating ensures stable operation in harsh environmental conditions

Applications

• Industrial automation and control systems requiring real-time processing
• Medical imaging devices needing high-performance FPGA acceleration
• Telecommunications infrastructure utilizing PCIe and Gigabit Ethernet interfaces
• Automotive infotainment and display control systems leveraging DisplayPort output

Procurement Notes

Verify current availability status as this product line may be subject to discontinuation or limited supply notifications. Confirm that the specific suffix FL corresponds to the intended hardware revision and pinout compatibility with your carrier board design. Request official end-of-life notifications or product change notices to ensure long-term project viability. Validate that the industrial temperature range meets your specific operational environment requirements before finalizing procurement decisions.

Selection Notes

Select this module when a compact SOM solution is required with integrated FPGA and ARM processing power. Ensure the carrier board design accommodates the 40x50 mm footprint and provides necessary power delivery for the ZU2EG-1E processor. Verify that the available I/O interfaces, such as SATA and USB 3.0, align with system connectivity needs. Consider thermal management solutions appropriate for the specified operating temperature range during mechanical design integration.

Part Context

This module belongs to the TE0820 series of System-on-Modules from Trenz Electronic, which are based on AMD Xilinx Zynq UltraScale+ MPSoC technology. The series offers various configurations tailored for different performance and interface requirements. The TE0820-04 variant specifically targets applications requiring robust connectivity options and reliable performance in industrial settings. It serves as a core computing unit for custom embedded designs.

FAQ

What is the primary processor architecture used in this module?

The module utilizes the AMD Xilinx Zynq UltraScale+ MPSoC, which combines a dual-core ARM Cortex-A53 application processor with a Xilinx FPGA fabric.

Does the module support external storage interfaces?

Yes, the module provides interfaces for eMMC and QSPI flash memory, allowing for flexible boot and storage configurations.

What is the maximum operating temperature for this component?

The module is rated for an industrial temperature range, with a maximum operating temperature of +85°C.