TE0820-04-40121FA

TE0820-04-40121FA

  • Description:MOD MPSOC 2GB DDR4
  • Series:TE0820

SKU:7ef7c17de45d Category: Brand:

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Product Detailed Parameters

  • Description:MOD MPSOC 2GB DDR4
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
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TE0820-04-40121FA

Overview

The TE0820-04-40121FA is a 4 x 5 cm System-on-Module featuring the Xilinx Zynq UltraScale+ MPSoC (XCZU2EG-1E). It integrates dual 8 Gb DDR4 SDRAM chips operating at 2400 Mbps, two 512 Mb QSPI flash memories in dual parallel mode, and an 8 GByte eMMC memory. The module includes a Lattice MachXO2 CPLD for system control, a Marvell Alaska 88E1512 Gigabit Ethernet PHY, and a Microchip USB3320 ULPI transceiver. It supports DisplayPort, PCIe, SATA 3.1, and USB 3.0 interfaces via three high-speed B2B connectors.

Feature Summary

  • Integrated Xilinx Zynq UltraScale+ MPSoC with Mali-400 MP2 GPU
  • On-board Lattice MachXO2 CPLD for centralized system management
  • Supports multiple boot modes including QSPI and SD Card
  • Includes programmable clock generator and power distribution network

Applications

  • Industrial automation controllers requiring robust processing
  • Medical imaging devices needing high-speed data acquisition
  • Automotive infotainment systems utilizing DisplayPort output
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific assembly version and component revisions against the latest technical reference manual before integration. Confirm that the carrier board design accommodates the required mechanical dimensions and connector mating heights. Ensure compatibility with the selected cooling solution for the intended operating temperature range.

Selection Notes

Select this module when a compact form factor is required alongside significant I/O capabilities. It is suitable for designs needing integrated storage and networking without external discrete components. Consider the available MGT lanes and HP I/O banks to ensure sufficient connectivity for the target application's interface requirements.

Part Context

This module belongs to the TE0820 family of industrial-grade System-on-Modules. These modules are designed for mechanical and electrical compatibility within the series, allowing for flexible migration between different processor variants while maintaining the same carrier board footprint and connector definitions.

Replacement Considerations

Consult the manufacturer's discontinuation notifications or product change notices for officially confirmed substitutes. Verify that any replacement maintains the same pinout and form factor to ensure carrier board compatibility.

TE0820-04-40121FATE0820-04-40121FA

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