TE0820-04-4AE21FA

TE0820-04-4AE21FA

  • Description:MOD MPSOC ZU4CG-1E 2GB DDR4 IND
  • Series:TE0820

SKU:d423e373e2b0 Category: Brand:

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Product Detailed Parameters

  • Description:MOD MPSOC ZU4CG-1E 2GB DDR4 IND
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0820-04-4AE21FA

Overview

The TE0820-04-4AE21FA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ MPSoC processor with integrated DDR4 SDRAM. The module features a compact form factor measuring 50 mm by 40 mm. Key interfaces include DisplayPort, eMMC, GMII, I2C, JTAG, PCIe, QSPI, SATA, and USB 3.0. The device operates within a temperature range of -40°C to +85°C.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC architecture
  • Includes onboard 2 GByte DDR4 SDRAM
  • Supports multiple high-speed peripheral interfaces including PCIe and SATA
  • Designed for industrial operating temperatures

Applications

  • Industrial automation controllers
  • Medical imaging systems
  • Aerospace and defense avionics
  • Test and measurement equipment

Procurement Notes

Verify current availability status as the product line may be discontinued or subject to supply constraints. Confirm specific processor speed grade and memory configuration against official datasheets before integration. Check for any Product Change Notifications (PCN) that might affect long-term support or component sourcing. Ensure compatibility with required carrier board designs regarding pinout and power requirements.

Selection Notes

Select this module when a ruggedized SOM with integrated FPGA and ARM processing is required. Compare against other TE0820 variants based on specific SoC performance tiers and interface needs. Ensure the target application fits within the 50x40 mm physical envelope. Verify thermal management solutions for the specified industrial temperature range.

Part Context

This part belongs to the TE0820 family of modular systems from Trenz Electronic. These modules are built around AMD Xilinx Zynq UltraScale+ MPSoCs, combining programmable logic with dual-core ARM Cortex-A53 processors. The series offers various configurations tailored for different performance and connectivity requirements in embedded environments.

Replacement Considerations

Check for direct substitutes within the TE0820 series offering similar SoC capabilities. Evaluate alternative SOM providers if specific interface sets differ. Verify mechanical footprint compatibility if replacing on existing carrier boards.

TE0820-04-4AE21FATE0820-04-4AE21FA

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