TE0820-04-50121FA

Overview

The TE0820-04-50121FA is a 4 x 5 cm industrial-grade system-on-module integrating a Xilinx Zynq UltraScale+ MPSoC. It features dual 8 Gb DDR4 SDRAM, an eMMC memory chip, and dual QSPI flash for configuration. The module includes a Lattice MachXO2 CPLD for system control, a Gigabit Ethernet PHY, and a USB 2.0 transceiver. It provides three high-speed board-to-board connectors with extensive I/O capabilities, including MGT lanes for high-speed serial interfaces.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with Mali-400 MP2 GPU
• Includes on-board Lattice MachXO2 CPLD for system management
• Equipped with dual DDR4 SDRAM and eMMC storage
• Features integrated Gigabit Ethernet and USB 2.0 OTG support

Applications

• Industrial automation controllers
• Medical imaging systems
• High-performance embedded computing
• Automotive infotainment units

Procurement Notes

Verify the specific SoC variant (ZU2 to ZU5) and speed grade required for your application, as these define performance characteristics. Confirm that the initial delivery state matches your needs, noting that flash and eMMC are typically unprogrammed upon shipment. Ensure carrier board design adheres to the specified mechanical dimensions and connector mating heights.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power and peripheral integration. Consider the available B2B connectors for interface requirements, particularly if high-speed serial communication via MGT lanes is necessary. Evaluate thermal management strategies, as operating temperature ranges depend on the specific cooling solution implemented in the final design.

Part Context

This module belongs to the Trenz Electronic TE0820 family of Zynq-based system-on-modules. These modules are designed for interchangeability within the 4x5 cm form factor, allowing for easy upgrades or downgrades of the underlying FPGA/SoC capabilities without redesigning the carrier board. They target applications requiring robust performance in industrial and extended temperature environments.

Replacement Considerations

Modules within the same TE0820 series offering different SoC variants may serve as functional replacements if pin compatibility and resource requirements align. Verify that the alternative variant supports the necessary memory configurations and interface speeds. Mechanical compatibility is generally maintained across the series, but electrical signal routing must be confirmed against the specific datasheet.