TE0820-05-2AI81MA

TE0820-05-2AI81MA

$351.90
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-

SKU:fb33e3bbaebb Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2CG-1SFVC784I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:2 x 100 Pin
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0820-05-2AI81MA

Overview

The TE0820-05-2AI81MA is a 4 x 5 cm System on Module integrating an AMD Zynq UltraScale+ MPSoC (ZU1/ZU2/ZU3/ZU4/ZU5), DDR4 SDRAM, eMMC memory, and flash storage. It includes a Lattice MachXO2 CPLD for system control, Gigabit Ethernet, and USB 2.0 transceivers. The module utilizes three high-speed Samtec Razor Beam LSHM connectors to provide extensive programmable logic and processing system I/O interfaces.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with up to 4 GByte DDR4 SDRAM
  • Includes Lattice MachXO2 CPLD for system controlling and configuration
  • Features integrated Gigabit Ethernet and USB 2.0 ULPI transceivers
  • Provides three high-speed board-to-board connectors for extensive I/O expansion

Applications

  • Industrial automation controllers requiring robust processing capabilities
  • Medical imaging systems needing high-speed data acquisition
  • Aerospace and defense avionics platforms
  • Test and measurement equipment requiring precise timing and control

Procurement Notes

Verify the specific SoC variant (ZU1-ZU5) and speed grade required for your application. Confirm the temperature range (Extended or Industrial) matches your environmental constraints. Ensure the carrier board design supports the recommended power-up sequencing and voltage levels specified in the technical documentation.

Selection Notes

Select based on the required number of Processing System MIOs, Programmable Logic HP IOs, and High-Speed Transceiver lanes. Consider the available memory configurations for DDR4, eMMC, and Flash. Evaluate the cooling solution requirements as operating temperature ranges depend on the customer design and thermal management.

Part Context

This module belongs to Trenz Electronic's 4 x 5 cm SoM family, designed for mechanical and electrical compatibility within the series. It serves as a compact, highly integrated platform for developers seeking to leverage Xilinx FPGA technology without designing complex baseboards from scratch.

Replacement Considerations

Modules within the same 4 x 5 cm form factor are mechanically compatible. Verify electrical pinout compatibility and component revisions before substituting. Consult the hardware revision history for changes in components like DCDC converters or memory chips that may affect design integration.

TE0820-05-2AI81MATE0820-05-2AI81MA
$351.90
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