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The TE0820-05-2BE81ML is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 SDRAM memory. The module adheres to a compact 4 x 5 cm form factor, facilitating integration into space-constrained designs. Key interface capabilities include DisplayPort, GMII Ethernet, PCIe, SATA 3.1, and USB 3.0 connectivity. The device supports an industrial operating temperature range from -40°C to +85°C, ensuring reliability in demanding environments.
Verify the specific silicon grade and memory configuration against the official datasheet before procurement. Confirm availability status as supply conditions may vary. Ensure compatibility with carrier boards regarding pinout and power requirements. Check for any recent product change notifications that might affect mechanical or electrical characteristics. Validate regulatory compliance certifications required for the target market.
Select this module when a balance of processing power and I/O density is required within a small form factor. Consider the TE0820 series if standardization across multiple projects is desired. Evaluate the need for specific interface speeds such as SATA 3.1 or USB 3.0. Compare against other Zynq UltraScale+ modules based on memory capacity and peripheral availability. Ensure the carrier board design supports the required thermal dissipation for the industrial temperature range.
This module belongs to the TE0820 series from Trenz Electronic, which focuses on AMD Xilinx Zynq UltraScale+ MPSoC technology. The series offers various configurations tailored for different performance and interface needs. Trenz Electronic specializes in providing robust SOM solutions for industrial and automotive sectors, emphasizing long-term availability and comprehensive support documentation.
Direct replacements are limited due to the proprietary nature of the SOM design. Evaluate other TE0820 variants with similar processor cores but different memory or interface configurations. Cross-reference with generic Zynq UltraScale+ development boards if form factor constraints can be relaxed. Verify software compatibility and BSP support for any alternative components.