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The TE0820-05-2BI21MA is a System-on-Module (SOM) from Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU3EG-1E variant, providing combined processing and programmable logic capabilities. The module includes 2 GByte of DDR4 SDRAM for data storage and high-speed access. It features a compact form factor with dimensions of 4 cm by 5 cm. Key interface capabilities include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0 support. The operational temperature range extends from 0°C to +85°C, suitable for industrial environments.
Verify current availability status as supply conditions may vary. Confirm specific revision levels and manufacturing dates against project requirements. Check for any Product Change Notifications (PCNs) that might affect long-term procurement plans. Ensure compatibility with existing carrier board designs before ordering.
Select this module when a balance between processing power and physical size is required. The ZU3EG-1E provides sufficient resources for moderate complexity FPGA designs alongside ARM processing. Consider the integrated DDR4 capacity for memory-intensive applications. Evaluate interface needs against the available DP, GMII, PCIe, and USB ports.
This part belongs to the TE0820 series of System-on-Modules by Trenz Electronic. These modules are built around AMD Xilinx Zynq UltraScale+ MPSoCs. The series offers various configurations based on different SoC models and memory sizes. The TE0820-05 variant typically denotes a specific generation or form factor within this product line.
Direct replacements depend on specific performance and interface requirements. Other modules in the TE0820 series with similar SoC specifications may serve as alternatives. Cross-vendor solutions would require significant redesign due to pinout and software differences. Verify mechanical and electrical compatibility if considering non-series substitutes.