TE0820-05-2BI21ML

TE0820-05-2BI21ML

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0820

SKU:cc7f7dbc0853 Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0820
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2EG-1SFVC784I
  • Co-Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:2 x 100 Pin
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0820-05-2BI21ML

Overview

The TE0820-05-2BI21ML is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU3CG-1SFVC784E processor core. The module includes 2 GByte of DDR4 SDRAM to support data processing and storage requirements. It features a compact form factor with dimensions of 4 cm x 5 cm (50 mm x 40 mm). The component supports industrial operating temperatures ranging from 0°C to +85°C.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC with programmable logic and ARM processors
  • Includes 2 GB DDR4 memory for high-bandwidth data handling
  • Supports multiple interface protocols including DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0
  • Compact 4x5 cm footprint suitable for space-constrained designs

Applications

  • Industrial automation and control systems requiring mixed-signal processing
  • Medical imaging devices needing high-speed data acquisition and display output
  • Automotive infotainment and telematics units utilizing PCIe and USB interfaces
  • Telecommunications infrastructure equipment requiring Gigabit Ethernet connectivity

Procurement Notes

Verify current availability status as distribution channels may vary. Confirm that the specific suffix indicates the correct processor variant and memory configuration for your design requirements. Check for any Product Change Notifications (PCN) related to component updates or lifecycle changes. Ensure compatibility with existing carrier board designs regarding pinout and power delivery specifications before procurement.

Selection Notes

Select this module when a balance between processing power and physical size is required. The inclusion of SATA 3.1 and USB 3.0 makes it suitable for applications involving high-speed storage or peripheral connectivity. Consider the thermal characteristics within the 0°C to +85°C range during system integration. Verify that the host system can support the necessary interface signals such as PCIe lanes and DisplayPort outputs.

Part Context

This part belongs to the TE0820 series of System-on-Modules from Trenz Electronic, which are based on AMD Xilinx Zynq UltraScale+ MPSoC technology. These modules are designed to accelerate development cycles by providing a pre-integrated hardware platform. The series typically offers various configurations differing in processor speed grades, memory capacity, and interface options to suit diverse embedded computing needs.

TE0820-05-2BI21MLTE0820-05-2BI21ML

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