SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE0820-05-2BI21ML is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU3CG-1SFVC784E processor core. The module includes 2 GByte of DDR4 SDRAM to support data processing and storage requirements. It features a compact form factor with dimensions of 4 cm x 5 cm (50 mm x 40 mm). The component supports industrial operating temperatures ranging from 0°C to +85°C.
Verify current availability status as distribution channels may vary. Confirm that the specific suffix indicates the correct processor variant and memory configuration for your design requirements. Check for any Product Change Notifications (PCN) related to component updates or lifecycle changes. Ensure compatibility with existing carrier board designs regarding pinout and power delivery specifications before procurement.
Select this module when a balance between processing power and physical size is required. The inclusion of SATA 3.1 and USB 3.0 makes it suitable for applications involving high-speed storage or peripheral connectivity. Consider the thermal characteristics within the 0°C to +85°C range during system integration. Verify that the host system can support the necessary interface signals such as PCIe lanes and DisplayPort outputs.
This part belongs to the TE0820 series of System-on-Modules from Trenz Electronic, which are based on AMD Xilinx Zynq UltraScale+ MPSoC technology. These modules are designed to accelerate development cycles by providing a pre-integrated hardware platform. The series typically offers various configurations differing in processor speed grades, memory capacity, and interface options to suit diverse embedded computing needs.