TE0820-05-3BE21ML

Overview

The TE0820-05-3BE21ML is a System-on-Module (SOM) from Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the XCZU3CG-1SFVC784E processor, paired with 2 GB of installed DDR4 SDRAM. The module features a compact form factor measuring 50 mm by 40 mm. It supports a wide operating temperature range from 0°C to +85°C. Key interfaces include DisplayPort, GMII, PCIe, SATA 3.1, and USB 3.0, providing versatile connectivity for industrial and commercial systems.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors alongside programmable logic fabric.
• Includes 2 GB of DDR4 SDRAM for high-bandwidth data processing and storage requirements.
• Supports multiple high-speed peripheral interfaces including PCIe, SATA 3.1, and USB 3.0 for robust system integration.

Applications

• Industrial automation controllers requiring real-time processing and FPGA flexibility.
• Medical imaging devices needing high-performance video output via DisplayPort.
• Automotive infotainment systems utilizing GMII Ethernet connectivity.
• Edge computing nodes leveraging PCIe expansion capabilities.

Procurement Notes

Verify current availability status as supply may be limited or discontinued. Confirm specific processor speed grade and memory configuration matches project requirements. Check for any Product Change Notifications (PCN) that might affect long-term supply or component substitutions. Ensure compatibility with existing carrier board designs regarding pinout and power delivery specifications.

Selection Notes

Select this module when a balance between processing power and form factor is required. The XCZU3CG device offers sufficient programmable logic resources for moderate complexity designs. Consider thermal management solutions given the +85°C maximum operating temperature limit. Validate interface requirements against available pins on the SOM connector before finalizing the design.

Part Context

This part belongs to the TE0820 series of modular systems from Trenz Electronic, which are based on Xilinx/AMD Zynq UltraScale+ MPSoCs. These modules are designed to accelerate development cycles by providing a pre-validated hardware platform. The series typically includes variants with different processor capacities and memory configurations to suit various performance tiers within the same physical footprint.

Replacement Considerations

Check for direct substitutes within the TE0820 series offering higher performance, such as those with larger FPGA arrays or more memory. Verify if newer generation MPSoC modules from Trenz Electronic maintain pin-to-pin compatibility. Consult official documentation for any end-of-life notices or recommended upgrade paths for legacy projects.