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The TE0821-01-2AE31PA is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with quad-core ARM Cortex-A53 and dual-core Cortex-R5 processors. The module features integrated DDR4 memory and extensive I/O interfaces, including PCIe, USB 3.0, SATA, and Gigabit Ethernet, housed in a compact form factor suitable for industrial and commercial environments.
Verify current availability status directly with Trenz Electronic or authorized distributors, as supply chain conditions may vary. Confirm that the specific ordering suffix matches the required hardware revision and pinout configuration for your carrier board design. Ensure compliance with relevant regional regulatory standards before integration into final products.
Select this module when a combined FPGA and processor solution is required within a small footprint. Consider the thermal performance requirements of the Zynq UltraScale+ device under your specific load conditions. Evaluate the available I/O pins against your interface needs, noting that some signals may be shared between different peripheral controllers.
This component belongs to the TE0821 family of SOMs from Trenz Electronic, which are based on Xilinx Zynq UltraScale+ MPSoC devices. These modules are engineered to accelerate development cycles by providing a pre-validated hardware platform. They serve as core computing units for various custom carrier boards tailored to specific industry applications.
No direct public substitutes are confirmed for this specific part number. Alternative solutions would require redesigning the carrier board due to differences in pinouts, power management, and firmware support. Consult Trenz Electronic for potential end-of-life notifications or recommended migration paths if discontinuation occurs.