TE0821-01-2AE31PA

TE0821-01-2AE31PA

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823

SKU:963d38765362 Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed:-
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:2 x 100 Pin
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0821-01-2AE31PA

Overview

The TE0821-01-2AE31PA is a System-on-Module manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Zynq UltraScale+ MPSoC architecture, combining programmable logic with quad-core ARM Cortex-A53 and dual-core Cortex-R5 processors. The module features integrated DDR4 memory and extensive I/O interfaces, including PCIe, USB 3.0, SATA, and Gigabit Ethernet, housed in a compact form factor suitable for industrial and commercial environments.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with heterogeneous processing system
  • Supports multiple high-speed peripheral interfaces including PCIe and USB 3.0
  • Compact modular design optimized for space-constrained embedded systems

Applications

  • Industrial automation and control systems
  • Medical imaging devices requiring high data throughput
  • Automotive infotainment and instrument clusters
  • Telecommunications infrastructure equipment

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply chain conditions may vary. Confirm that the specific ordering suffix matches the required hardware revision and pinout configuration for your carrier board design. Ensure compliance with relevant regional regulatory standards before integration into final products.

Selection Notes

Select this module when a combined FPGA and processor solution is required within a small footprint. Consider the thermal performance requirements of the Zynq UltraScale+ device under your specific load conditions. Evaluate the available I/O pins against your interface needs, noting that some signals may be shared between different peripheral controllers.

Part Context

This component belongs to the TE0821 family of SOMs from Trenz Electronic, which are based on Xilinx Zynq UltraScale+ MPSoC devices. These modules are engineered to accelerate development cycles by providing a pre-validated hardware platform. They serve as core computing units for various custom carrier boards tailored to specific industry applications.

Replacement Considerations

No direct public substitutes are confirmed for this specific part number. Alternative solutions would require redesigning the carrier board due to differences in pinouts, power management, and firmware support. Consult Trenz Electronic for potential end-of-life notifications or recommended migration paths if discontinuation occurs.

TE0821-01-2AE31PATE0821-01-2AE31PA

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