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Product Detailed Parameters
- Description：MPSOC MODULE WITH XILINX ZYNQ UL
- Series：TE0823
- Mfr：Trenz Electronic GmbH
- Package：Bulk
- Module/Board Type：MPU Core
- Core Processor：Zynq UltraScale+ XCZU3CG-1SFVC784E
- Co-Processor：ARM® Cortex®-A53, ARM® Cortex®-R5
- Speed：-
- Flash Size：128MB
- RAM Size：4GB
- Connector Type：2 x 100 Pin
- Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature：0°C ~ 85°C
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Overview
The Trenz Electronic TE0821-01-3AE31PA is a System-on-Module featuring the Xilinx Zynq UltraScale+ MPSoC (ZU2EG-1E) in an SFVC784 package. It integrates dual 8Gb DDR4 SDRAM chips operating at 2400 Mbps and 512Mb QSPI flash memory configured in dual parallel mode. The module includes an 8Gb eMMC chip, a Lattice MachXO2 CPLD for system control, and a Marvell Alaska 88E1512 Ethernet PHY. It provides four MGT lanes, USB 3.0 interfaces, and DisplayPort support within a 40 x 50 mm form factor.
Feature Summary
- Integrates Xilinx Zynq UltraScale+ MPSoC with Mali-400 MP2 GPU
- Includes Lattice MachXO2 CPLD for centralized system management
- Features robust high-speed Samtec Razor Beam board-to-board connectors
- Supports multiple boot modes including QSPI and SD Card
Applications
- Industrial automation and machine vision systems
- High-performance embedded computing platforms
- Medical imaging and diagnostic equipment
- Automotive infotainment and cockpit displays
Procurement Notes
Verify the specific assembly version and component revisions against the current datasheet before procurement. Confirm availability of the exact ordering suffix as product lines may undergo changes. Ensure compatibility with the intended carrier board design regarding mechanical dimensions and connector mating heights.
Selection Notes
Select this module when a compact 4x5 cm footprint is required alongside significant processing power from the Zynq UltraScale+ architecture. Consider the integrated peripherals such as the on-board Ethernet PHY and USB transceivers to simplify carrier board designs. Evaluate thermal requirements based on the industrial temperature range specifications.
Part Context
This module belongs to the TE0821 series, which utilizes the 4 x 5 cm form factor standard established by Trenz Electronic. These modules are designed for mechanical and electrical compatibility within the family, allowing for scalable upgrades or downgrades while maintaining consistent carrier board interfaces.
Replacement Considerations
Consult the manufacturer's documentation for officially confirmed substitutes. Verify that any replacement maintains the same processor family, pinout compatibility, and peripheral integration to ensure seamless migration without redesigning the carrier board.
FAQ
How is JTAG access managed on the TE0821 module?
JTAG access to the Xilinx Zynq UltraScale+ MPSoC is routed through the Lattice MachXO CPLD via the B2B connector JM2, allowing for system-level debugging and configuration.
What is the default boot configuration for the module?
The module supports boot from Dual QSPI Flash Memory or SD Card. The MODE pin determines the active boot source, with High selecting QSPI and Low selecting SD Card by default.
Which Ethernet PHY is integrated into the module?
The TE0821 incorporates a Marvell Alaska 88E1512 Gigabit Ethernet PHY, connected to the Zynq PS GEM0 via an RGMII interface with fixed 1.8V I/O voltage.
