TE0821-01-3BE21ML

TE0821-01-3BE21ML

$442.85
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823

SKU:e744613ce712 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:2 x 100 Pin
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0821-01-3BE21ML

Overview

The Trenz Electronic TE0821-01-3BE21ML is a 4 x 5 cm System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC (ZU2EG-1E) with 2 GB DDR4 SDRAM. It features dual 64 MB QSPI flash, an eMMC memory controller, and a Lattice MachXO2 CPLD for system management. The module provides high-speed interfaces including USB 3.0, Gigabit Ethernet via RGMII, PCIe, SATA 3.1, and DisplayPort. Operating within the industrial temperature range of 0°C to +85°C, it utilizes three Samtec Razor Beam connectors for board-to-board connectivity.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with Mali-400 MP2 GPU
  • Includes Lattice MachXO2 CPLD for centralized system control and power sequencing
  • Supports multiple boot sources including QSPI flash and SD card
  • Features rugged mechanical design suitable for shock and high vibration environments

Applications

  • Industrial automation controllers requiring real-time processing
  • Medical imaging devices needing high-resolution video output
  • Automotive infotainment systems utilizing GPU capabilities
  • Telecommunications infrastructure equipment
  • Test and measurement instrumentation platforms

Procurement Notes

Verify the specific assembly version corresponds to the required processor speed grade and temperature rating. Confirm that the initial delivery state matches project needs, as storage devices are typically unprogrammed upon shipment. Ensure compatibility with carrier board voltage levels and connector mating heights before integration.

Selection Notes

Select this module when a compact form factor is required alongside significant programmable logic resources. The inclusion of dedicated high-speed transceivers supports complex data acquisition tasks. Consider the on-board peripherals such as the Ethernet PHY and USB transceiver to reduce external component count in the final design.

Part Context

This module belongs to the TE0821 family of MPSoC modules designed by Trenz Electronic. These modules are mechanically and largely electrically compatible with other variants in the 4 x 5 cm series. They serve as building blocks for custom embedded designs, leveraging the versatility of the Zynq UltraScale+ architecture.

Replacement Considerations

Direct replacements must match the SFVC784 package and pinout compatibility. Verify that alternative modules support the same peripheral inventory, including the specific Marvell Ethernet PHY and Microchip USB transceiver, to minimize carrier board redesign efforts.

FAQ

How is JTAG access managed on the TE0821?

JTAG access to the Zynq UltraScale+ MPSoC is routed through the Lattice MachXO2 CPLD via the B2B connector JM2. The JTAGEN signal determines whether the CPLD or the SoC is accessed.

What is the default boot configuration?

The module defaults to QSPI boot mode when the MODE pin is held high. An alternative SD Card boot option is available if the MODE pin is pulled low.

Which Ethernet interface is supported onboard?

The module features a 1 Gbps RGMII Ethernet interface using the Marvell Alaska 88E1512 PHY. SGMII pins are also available on the B2B connector for direct PHY connection.

TE0821-01-3BE21MLTE0821-01-3BE21ML
$442.85
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