TE0821-01-3BI21MA

TE0821-01-3BI21MA

$519.35
  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823

SKU:d7a12196c6b7 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq™ UltraScale+™ XCZU3EG-1SFVC784I
  • Co-Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:2 x 160 Pin
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0821-01-3BI21MA

Overview

The Trenz Electronic TE0821-01-3BI21MA is a System-on-Module featuring the Xilinx Zynq UltraScale+ MPSoC ZU3EG-1. It integrates dual 8 Gb DDR4 SDRAM chips providing 2 GB capacity and an 8 Gb eMMC memory chip. The module measures 40 x 50 mm and includes a Lattice MachXO2 CPLD for system control, dual QSPI flash, and a Marvell Ethernet PHY.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with embedded ARM processors and programmable logic
  • Includes on-board Lattice MachXO2 CPLD for centralized system management and power sequencing
  • Provides high-speed connectivity via four MGT lanes supporting PCIe and SATA interfaces
  • Features robust mechanical design suitable for shock and high vibration environments

Applications

  • Industrial automation and control systems requiring reliable processing
  • Medical imaging devices needing high-performance video output
  • Aerospace and defense applications demanding ruggedized computing modules
  • Test and measurement equipment utilizing high-speed data acquisition

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product matrix to ensure component availability and revision alignment. Confirm that the selected variant matches the required processor speed grade and temperature rating for the intended deployment environment before finalizing procurement.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA resources and multiple high-speed serial interfaces. Ensure the carrier board design accommodates the specific B2B connector pinout and voltage levels defined in the technical reference manual for proper signal integrity.

Part Context

This module belongs to the TE0821 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are engineered for compatibility within the same physical footprint, allowing for scalable performance upgrades while maintaining mechanical interchangeability across different processor variants in the series.

Replacement Considerations

Consult the official Trenz Electronic documentation for verified direct substitutes within the TE0821 series. Cross-compatibility with other manufacturers' modules requires careful evaluation of mechanical dimensions, pin assignments, and electrical specifications.

TE0821-01-3BI21MATE0821-01-3BI21MA
$519.35
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