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The Trenz Electronic TE0821-01-3BI21MA is a System-on-Module featuring the Xilinx Zynq UltraScale+ MPSoC ZU3EG-1. It integrates dual 8 Gb DDR4 SDRAM chips providing 2 GB capacity and an 8 Gb eMMC memory chip. The module measures 40 x 50 mm and includes a Lattice MachXO2 CPLD for system control, dual QSPI flash, and a Marvell Ethernet PHY.
Verify the specific ordering suffix against the manufacturer's current product matrix to ensure component availability and revision alignment. Confirm that the selected variant matches the required processor speed grade and temperature rating for the intended deployment environment before finalizing procurement.
Select this module when a compact form factor is required alongside significant FPGA resources and multiple high-speed serial interfaces. Ensure the carrier board design accommodates the specific B2B connector pinout and voltage levels defined in the technical reference manual for proper signal integrity.
This module belongs to the TE0821 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are engineered for compatibility within the same physical footprint, allowing for scalable performance upgrades while maintaining mechanical interchangeability across different processor variants in the series.
Consult the official Trenz Electronic documentation for verified direct substitutes within the TE0821 series. Cross-compatibility with other manufacturers' modules requires careful evaluation of mechanical dimensions, pin assignments, and electrical specifications.