TE0821-02-2AE91PA

Overview

The TE0821-02-2AE91PA is a System-on-Module manufactured by Trenz Electronic, integrating the Xilinx Zynq UltraScale+ MPSoC ZU3EG-2SFVC784I. This module features 2 GByte of DDR4 SDRAM and supports high-speed interfaces including PCIe, SATA, USB 3.0, DisplayPort, GMII, I2C, JTAG, and QSPI. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C. The compact form factor measures 40 mm x 50 mm, facilitating integration into space-constrained embedded systems requiring robust processing capabilities.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual ARM Cortex-A53 cores and programmable logic
• Includes onboard 2 GByte DDR4 SDRAM for high-bandwidth data processing
• Supports multiple high-speed peripheral interfaces such as PCIe Gen3, SATA, and USB 3.0
• Industrial temperature rating ensures reliable operation in harsh environments

Applications

• Industrial automation and control systems
• Medical imaging devices requiring high-performance processing
• Telecommunications infrastructure equipment
• Automotive infotainment and driver assistance systems

Procurement Notes

Verify current availability status as this component may be subject to discontinuation or limited supply notifications. Confirm that the specific suffix '2AE91PA' matches the required silicon stepping and interface configuration. Check for any Product Change Notifications (PCN) issued by Trenz Electronic regarding material or manufacturing updates. Ensure compatibility with existing carrier board designs before procurement.

Selection Notes

Select this module when a combined processor and FPGA solution is required within a small footprint. It is suitable for designs needing direct connectivity to storage via SATA or high-speed expansion via PCIe. Consider the thermal requirements of the ZU3EG chip and ensure adequate cooling solutions are integrated into the final product design for sustained industrial operation.

Part Context

This part belongs to the TE0821 family of System-on-Modules from Trenz Electronic, which are based on AMD/Xilinx Zynq UltraScale+ MPSoC technology. These modules are designed to accelerate development cycles for complex embedded applications by providing a pre-validated hardware platform. The family offers various memory and interface configurations to suit different performance and connectivity needs.

Replacement Considerations

Check for official successor modules within the Trenz Electronic portfolio that utilize newer MPSoC variants. Verify if alternative SOM providers offer comparable Zynq UltraScale+ modules with similar pinouts and memory configurations. Review any End-of-Life (EOL) notices from Trenz Electronic to determine recommended transition paths.