TE0821-02-3AE91PA

TE0821-02-3AE91PA

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-

SKU:17f6afe5779d Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
  • Operating Temperature:-

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TE0821-02-3AE91PA

Overview

The TE0821-02-3AE91PA is a System-on-Module manufactured by Trenz Electronic, integrating the Xilinx Zynq UltraScale+ MPSoC ZU3EG-2FFVC1760I. It features 4 GB of DDR4 SDRAM and 512 MB of QSPI Flash memory. The module supports high-speed interfaces including DisplayPort, PCIe Gen3, SATA, USB 3.0, GMII Ethernet, I2C, JTAG, and QSPI. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C and utilizes a compact form factor.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with dual ARM Cortex-A53 cores and programmable logic
  • Includes onboard switch-mode power delivery subsystem with multiple DC/DC converters and LDO regulators
  • Supports rugged board-to-board stacking connectors for high-speed transceiver I/O connectivity
  • Features ultra-low jitter PLL providing clocks to serial transceivers

Applications

  • Industrial automation and control systems requiring mixed-signal processing
  • Medical imaging devices needing high-performance video output via DisplayPort
  • Automotive infotainment and telematics units utilizing PCIe and USB interfaces
  • Telecommunications infrastructure equipment requiring robust Ethernet connectivity

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm end-of-life status and availability of long-term supply agreements. Check for recent Product Change Notifications (PCNs) that may affect pinout or electrical characteristics. Ensure compatibility with existing carrier boards regarding mechanical dimensions and connector types.

Selection Notes

Select this module when high computational performance is required alongside flexible I/O options. Consider the integrated power management capabilities for simplified board design. Evaluate thermal requirements given the dense integration on a small footprint. Compare against lower-tier MPSoC variants if cost or power consumption is a primary constraint.

Part Context

This module belongs to the TE0821 series of UltraSoM+ products from Trenz Electronic. These modules are designed to simplify the integration of complex Xilinx processors into custom hardware. They provide a pre-validated platform for rapid prototyping and production deployment in demanding environments.

TE0821-02-3AE91PATE0821-02-3AE91PA

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