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The TE0821-02-3AE91PA is a System-on-Module manufactured by Trenz Electronic, integrating the Xilinx Zynq UltraScale+ MPSoC ZU3EG-2FFVC1760I. It features 4 GB of DDR4 SDRAM and 512 MB of QSPI Flash memory. The module supports high-speed interfaces including DisplayPort, PCIe Gen3, SATA, USB 3.0, GMII Ethernet, I2C, JTAG, and QSPI. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C and utilizes a compact form factor.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm end-of-life status and availability of long-term supply agreements. Check for recent Product Change Notifications (PCNs) that may affect pinout or electrical characteristics. Ensure compatibility with existing carrier boards regarding mechanical dimensions and connector types.
Select this module when high computational performance is required alongside flexible I/O options. Consider the integrated power management capabilities for simplified board design. Evaluate thermal requirements given the dense integration on a small footprint. Compare against lower-tier MPSoC variants if cost or power consumption is a primary constraint.
This module belongs to the TE0821 series of UltraSoM+ products from Trenz Electronic. These modules are designed to simplify the integration of complex Xilinx processors into custom hardware. They provide a pre-validated platform for rapid prototyping and production deployment in demanding environments.