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The TE0821-02-3BI81MA is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 SDRAM and flash memory within a compact 4 x 5 cm form factor. The module supports industrial operating temperatures ranging from -40°C to +85°C and provides high-speed interfaces including DisplayPort, PCIe, SATA 3.1, GMII Ethernet, and USB 3.0 for versatile connectivity in demanding environments.
Verify current availability status as this component may be subject to discontinuation or limited supply notifications. Confirm specific configuration options such as memory capacity and interface selections against the latest manufacturer documentation before procurement. Ensure compatibility with carrier boards regarding mechanical dimensions and electrical signaling levels.
Select this module when a compact SOM solution combining ARM Cortex-A53 processors with Xilinx FPGA fabric is required. Consider the available I/O interfaces like PCIe and SATA for storage and expansion needs. Evaluate thermal management requirements given the industrial temperature rating and power consumption characteristics of the integrated MPSoC architecture.
This part belongs to the TE0821 series of System-on-Modules from Trenz Electronic, which are based on Xilinx Zynq UltraScale+ MPSoC technology. The series offers various configurations tailored for different performance and interface requirements while maintaining a standardized small form factor. These modules serve as core computing units for custom embedded designs across multiple industries.
Check for official product change notifications or end-of-life announcements from Trenz Electronic. Identify equivalent modules within the same TE0821 family that may offer updated components or revised specifications. Consult distributor databases for cross-reference information if direct substitutes are not explicitly listed by the manufacturer.