TE0823-01-3PIU1F

TE0823-01-3PIU1F

  • Description:ICOBOARD
  • Series:TE0823

SKU:b840551c001f Category: Brand:

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Product Detailed Parameters

  • Description:ICOBOARD
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor:Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed:-
  • Flash Size:128MB
  • RAM Size:1GB
  • Connector Type:USB
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0823-01-3PIU1F

Overview

The Trenz Electronic TE0823-01-3PIU1F is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU3EG MPSoC. It features 1 GByte LPDDR4 SDRAM, 8 GB eMMC storage, and dual 64 MB QSPI Flash for configuration. The module includes a Lattice MachXO2 CPLD for system control, a Marvell Alaska 88E1512 Gigabit Ethernet PHY, and a Microchip USB3320 ULPI transceiver. Power management utilizes onboard switch-mode regulators. The 40 x 50 mm form factor provides rugged board-to-board stacking connectors supporting high-speed I/Os.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with programmable logic and processing system
  • Includes onboard Lattice MachXO2 CPLD for system controller functions
  • Features rugged high-speed Samtec Razor Beam board-to-board connectors
  • Supports multiple boot modes including QSPI and SD Card

Applications

  • Industrial automation and embedded control systems
  • High-speed data acquisition and measurement applications
  • Embedded digital signal processing implementations
  • Prototyping and development of custom FPGA designs

Procurement Notes

Verify the specific assembly variant against the datasheet, as component options such as RAM speed and device family depend on the selected configuration. Confirm that the required temperature range aligns with the industrial specifications provided in the technical manual. Ensure compatibility with the intended baseboard connector mating height and electrical ratings before integration.

Selection Notes

Select this module when a low-power MPSoC solution with integrated memory and peripherals is required within a compact footprint. The inclusion of dedicated Ethernet and USB interfaces reduces external component count. Consider the available MGT lanes and I/O counts to ensure sufficient connectivity for the target application's high-speed requirements.

Part Context

Trenz Electronic GmbH manufactures this module as part of its modular System-on-Module portfolio. The company specializes in FPGA and SoC-based development services and products for industrial environments. These modules are designed to be mechanically and electrically compatible with other units in the same form factor series, facilitating scalable design transitions.

Replacement Considerations

Modules within the 4x5 cm form factor series offer mechanical and partial electrical compatibility. Verify pinout alignment and voltage levels when substituting with other variants from the same manufacturer's product line to ensure seamless integration into existing carrier designs.

FAQ

How is JTAG access managed on the TE0823?

JTAG access to the Xilinx Zynq UltraScale+ is routed through the Lattice MachXO2 CPLD via the B2B connector JM2.

What clock sources are available on the module?

The module includes three MEMS oscillators providing frequencies of 25 MHz, 52 MHz, and 80 MHz.

Which Ethernet PHY is integrated on the board?

A Marvell Alaska 88E1512 chip serves as the Gigabit Ethernet PHY, connected via RGMII to the PS GEM0 interface.

TE0823-01-3PIU1FTE0823-01-3PIU1F

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