TE0823-01-3PIU1FA

TE0823-01-3PIU1FA

  • Description:ICOBOARD
  • Series:TE0823

SKU:6543933b5cc6 Category: Brand:

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Product Detailed Parameters

  • Description:ICOBOARD
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor:Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
  • Speed:-
  • Flash Size:128MB
  • RAM Size:1GB
  • Connector Type:USB
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0823-01-3PIU1FA

Overview

The Trenz Electronic TE0823-01-3PIU1FA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU3EG MPSoC. It features 1 GB of LPDDR4 SDRAM, 8 GB eMMC storage, and dual 512 Mb QSPI Flash. The module includes a Lattice MachXO2 CPLD for system control, a Marvell Alaska 88E1512 Gigabit Ethernet PHY, and a Microchip USB3320 ULPI transceiver. Power management utilizes onboard switch-mode regulators.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with programmable logic and processing system
  • Includes Lattice MachXO2 CPLD for dedicated system controller functions
  • Features rugged high-speed stacking connectors for extensive I/O access
  • Provides onboard Gigabit Ethernet and USB 2.0 OTG capabilities

Applications

  • Industrial automation and control systems
  • Embedded computing platforms requiring mixed-signal processing
  • Network infrastructure equipment with Ethernet connectivity
  • Portable test and measurement devices

Procurement Notes

Verify the specific assembly variant against the datasheet to ensure compatibility with required memory configurations and temperature ranges. Confirm that the initial delivery state meets project needs, as flash and eMMC may arrive unprogrammed while the CPLD contains firmware. Check for any product change notifications regarding component substitutions or revision updates before finalizing procurement.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power and peripheral integration. The inclusion of both DDR4 and eMMC supports complex boot sequences and large data handling. Ensure the carrier board design accommodates the specific B2B connector mating heights and voltage levels defined in the technical specifications.

Part Context

This module belongs to the TE0823 family of 4x5 cm System-on-Modules designed by Trenz Electronic. These modules are engineered for mechanical and electrical compatibility within their series, allowing for scalable design transitions. The TE0823 specifically targets applications demanding robust performance in constrained spaces with industrial reliability requirements.

Replacement Considerations

Consult the manufacturer's documentation for current alternatives if discontinuation occurs. Verify pinout and mechanical compatibility with existing carrier boards before transitioning to successor models or different SoC variants within the same module family.

FAQ

How is JTAG access managed on the TE0823?

JTAG access to the Xilinx Zynq UltraScale+ is routed through the Lattice MachXO2 CPLD via the B2B connector JM2. The JTAGEN signal determines whether the connection targets the SoC or the CPLD.

What clock sources are available on the module?

The module integrates three MEMS oscillators providing frequencies of 25 MHz, 52 MHz, and 80 MHz to support various peripherals including the Ethernet PHY, USB transceiver, and programmable clock generator.

Can the Ethernet interface operate in SGMII mode?

Yes, the on-board Marvell Alaska 88E1512 PHY supports SGMII mode. The relevant pins are accessible via the B2B connector JM3, allowing direct connection to SFP copper or fiber modules.

TE0823-01-3PIU1FATE0823-01-3PIU1FA

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