TE0823-01-S002

TE0823-01-S002

  • Description:ICOBOARD
  • Series:TE0823

SKU:8d2dc615cfcf Category: Brand:

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Product Detailed Parameters

  • Description:ICOBOARD
  • Series:TE0823
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A53, ARM® Cortex®-R5
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:USB
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0823-01-S002

Overview

The Trenz Electronic TE0823-01-S002 is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC with 1 GB LPDDR4 SDRAM and 8 GB eMMC storage. It features dual QSPI flash, a Lattice MachXO2 CPLD for system control, and rugged high-speed stacking connectors providing extensive I/O access. The module includes on-board power regulation, Gigabit Ethernet, USB 2.0 OTG, and programmable clock generation within a compact 40 x 50 mm form factor.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with low-power architecture
  • Includes Lattice MachXO2 CPLD for dedicated system management
  • Features rugged board-to-board stacking connectors for high-speed I/O
  • Provides comprehensive on-board peripherals including Ethernet and USB

Applications

  • Industrial automation and control systems
  • Embedded digital signal processing applications
  • High-speed data acquisition modules
  • Ruggedized embedded computing platforms

Procurement Notes

Verify the specific assembly variant against the datasheet to ensure compatibility with required memory configurations and processor speed grades. Confirm that the industrial temperature range meets operational environmental requirements. Check for any product change notifications or revision updates that may affect mechanical or electrical characteristics before finalizing procurement specifications.

Selection Notes

Select this module when a compact, industrial-grade SoM is required with integrated memory and robust connectivity options. Ensure the host carrier design supports the Samtec Razor Beam connector mating height and speed ratings. Verify that the available MIOs and PL I/Os meet the interface requirements for the target application, particularly regarding the Gigabit Ethernet and USB OTG implementations.

Part Context

This module belongs to the Trenz Electronic 4x5 cm form factor series, designed for mechanical and electrical compatibility within the family. It utilizes the Zynq UltraScale+ MPSoC ecosystem, allowing developers to leverage existing FPGA and ARM processor development tools. The module serves as a core component for custom embedded designs requiring high performance in a small footprint.

Replacement Considerations

Consult the official Trenz Electronic documentation for current alternative modules within the TE0823 series or compatible form factors. Verify pinout and functional equivalence if substituting with other variants in the same package family. Ensure that any replacement maintains the required industrial temperature rating and connector specifications.

FAQ

How is JTAG access managed on the TE0823 module?

JTAG access to the Xilinx Zynq UltraScale+ is routed through the Lattice MachXO2 CPLD via the B2B connector JM2. The JTAGEN signal determines whether the connection targets the FPGA or the CPLD.

What is the default boot mode configuration?

The module defaults to QSPI boot mode when the MODE signal is held Low. Setting the MODE signal High configures the module to boot from an SD Card.

Which components are included in the initial delivery state?

The QSPI Flash, eMMC Memory, and Programmable Clock Generator are delivered unprogrammed. The Lattice MachXO2 CPLD is pre-loaded with SC0820-02 QSPI Firmware for system control.

TE0823-01-S002TE0823-01-S002

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