TE0830-01-ABI26FAP

TE0830-01-ABI26FAP

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:64e1a5667177 Category: Brand:

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Product Detailed Parameters

  • Description:MPSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ ZU11EG-1I
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:16GB
  • Connector Type:2 x 400 Pin
  • Size / Dimension:4.724" L x 4.724" W (120.00mm x 120.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0830-01-ABI26FAP

Overview

The TE0830-01-ABI26FAP is a System-on-Module manufactured by Trenz Electronic GmbH, designed for high-performance embedded applications. It utilizes the Xilinx Zynq UltraScale+ MPSoC processor core and adheres to the COM-HPC standard, measuring 12 x 12 cm. This module integrates processing capabilities with programmable logic, offering a compact solution for complex computing tasks within industrial or specialized electronic systems.

Feature Summary

  • COM-HPC compatible form factor
  • Zynq UltraScale+ MPSoC integration

Applications

  • Industrial embedded computing
  • High-performance FPGA systems
  • Complex signal processing units

Part Context

This component belongs to the Trenz Electronic TE0830 series of COM-HPC compatible modules. It is specifically engineered around the Xilinx Zynq UltraScale+ architecture, providing a standardized interface for developers requiring both ARM processing cores and programmable logic in a dense, industry-standard package.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

TE0830-01-ABI26FAPTE0830-01-ABI26FAP

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