TE0835-02-MXE21-A

TE0835-02-MXE21-A

$5,003.95
  • Description:RFSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™

SKU:1c9b8f99e9ac Category: Brand:

  
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Product Detailed Parameters

  • Description:RFSOC MODULE WITH XILINX ZYNQ UL
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq™ UltraScale+™ XCZU25DR-1FFVE1156E
  • Co-Processor:ARM® Cortex®-A53, ARM® Cortex®-R5
  • Speed:1.3GHz
  • Flash Size:128MB
  • RAM Size:4GB
  • Connector Type:Board-to-Board (BTB) Socket
  • Size / Dimension:3.543" L x 2.559" W (90.00mm x 65.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0835-02-MXE21-A

Overview

The TE0835-02-MXE21-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ RFSoC device, combining programmable logic with processing system capabilities and integrated radio frequency data converters. The module includes onboard memory subsystems to support high-performance data acquisition and signal processing tasks in demanding environments.

Feature Summary

  • Integrates AMD Xilinx Zynq UltraScale+ RFSoC FPGA technology
  • Combines programmable logic with ARM Cortex-A53/A9 processors
  • Includes integrated high-speed analog-to-digital and digital-to-analog converters
  • Supports complex real-time signal processing and control applications

Applications

  • Software-defined radio systems
  • Advanced radar and electronic warfare platforms
  • High-speed data acquisition instruments
  • Test and measurement equipment requiring precise timing

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply conditions. Confirm compatibility with existing carrier boards and ensure that the required memory configuration matches project specifications. Consult official Trenz Electronic documentation for end-of-life notifications and recommended alternative part numbers if necessary.

Selection Notes

Select this module when application requirements demand tight integration of RF front-end processing with programmable logic. Evaluate thermal management solutions suitable for the RFSoC power dissipation characteristics. Ensure that the host system provides adequate cooling and that the pinout compatibility aligns with the intended baseboard design constraints.

Part Context

This component belongs to the Trenz Electronic TE0835 SOM family, which specializes in modules based on Xilinx Zynq UltraScale+ MPSoC and RFSoC devices. These modules are engineered to provide a compact form factor while exposing high-speed interfaces for custom carrier board development, targeting industrial, aerospace, and defense sectors.

TE0835-02-MXE21-ATE0835-02-MXE21-A
$5,003.95
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