TE0835-03-MXE81-A

TE0835-03-MXE81-A

  • Description:RFSOC MODULE WITH XILINX ZYNQ UL
  • Series:-

SKU:8bce99d1e869 Category: Brand:

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Product Detailed Parameters

  • Description:RFSOC MODULE WITH XILINX ZYNQ UL
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
  • Operating Temperature:-

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TE0835-03-MXE81-A

Overview

The TE0835-03-MXE81-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Xilinx Zynq UltraScale+ RFSoC device, combining programmable logic with processing system capabilities and integrated radio frequency data converters. The module includes onboard memory components to support system operation and configuration requirements within a compact form factor suitable for industrial and communication systems.

Feature Summary

  • Integrates AMD Xilinx Zynq UltraScale+ RFSoC FPGA technology
  • Combines programmable logic with high-speed RF data conversion capabilities
  • Includes onboard DDR4 SDRAM and Flash memory for system stability
  • Designed as a modular System-on-Module (SOM) for rapid integration

Applications

  • Software-defined radio and wireless communication infrastructure
  • Industrial automation and control systems requiring real-time processing
  • Test and measurement equipment utilizing high-speed data acquisition
  • Aerospace and defense electronic warfare systems

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as this specific model may be subject to discontinuation or limited supply conditions. Confirm that the ordering suffix corresponds to the exact hardware revision and memory configuration required for your design. Request official EOL notifications if applicable to ensure long-term project viability.

Selection Notes

Select this module when RFSoC integration is required to reduce board space and complexity compared to discrete solutions. Ensure the host carrier board supports the specific pinout and power delivery requirements of the TE0835 series. Evaluate thermal management needs based on the RFSoC's power consumption profiles under load.

Part Context

This component belongs to the TE0835 family of System-on-Modules from Trenz Electronic, which focuses on Xilinx Zynq UltraScale+ MPSoC and RFSoC devices. These modules are engineered to provide a robust foundation for complex embedded designs, offering verified hardware platforms that accelerate development cycles for professional engineering teams.

Replacement Considerations

Check for updated revisions within the TE0835 series or alternative SOMs from Trenz Electronic featuring newer RFSoC generations. Verify pin-to-pin compatibility with existing carrier boards before transitioning to any substitute models to avoid redesign efforts.

TE0835-03-MXE81-ATE0835-03-MXE81-A

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