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The TE0841-01-040-1C is a System-on-Module manufactured by Trenz Electronic. It integrates an AMD Zynq UltraScale+ MPSoC with integrated memory and storage interfaces. The module supports high-speed connectivity including PCIe, USB 3.0, and Gigabit Ethernet. Designed for industrial applications, it operates within a specified temperature range and provides flexible I/O expansion through standard connectors.
Verify current availability status as the product line may be subject to discontinuation notices. Confirm compatibility with existing carrier boards and ensure that required interface protocols are supported by the specific silicon revision. Check for any Product Change Notifications that might affect pinout or electrical characteristics before finalizing procurement plans.
Select this module when a compact solution combining ARM Cortex-A53 processors with FPGA fabric is required. Ensure the target application utilizes the available DDR4 memory capacity and eMMC storage. Verify that the operating temperature range meets environmental requirements and that sufficient GPIOs are accessible via the module connector for custom peripheral interfacing.
Trenz Electronic specializes in modular computing solutions based on Xilinx and AMD FPGAs and SoCs. The TE0841 series represents their System-on-Module offerings, providing pre-certified hardware platforms to accelerate development cycles. These modules are typically paired with custom baseboards to create complete embedded systems for demanding industrial and commercial sectors.
Check official Trenz Electronic documentation for direct successor models within the TE08xx series. Evaluate alternative SOM providers offering similar Zynq UltraScale+ configurations if supply constraints persist. Ensure mechanical footprint and pinout compatibility when considering third-party replacements to minimize redesign efforts.