TE0841-01-040-1I

TE0841-01-040-1I

  • Description:IC MODULE USCALE 4GB 32MB
  • Series:TE0841

SKU:d6517bbe630c Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE USCALE 4GB 32MB
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU40
  • Co-Processor:-
  • Speed:-
  • Flash Size:32MB
  • RAM Size:4GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0841-01-040-1I

Overview

The TE0841-01-040-1I is a System-on-Module manufactured by Trenz Electronic. It integrates an AMD Xilinx Zynq 7020 SoC, featuring dual ARM Cortex-A9 processors and programmable logic resources. The module includes 1 GB of DDR3 SDRAM and 32 GB of e.MMC storage for data retention and boot operations. Standard interfaces include Ethernet, JTAG, QSPI, and USB 2.0 connectivity. The component operates within an industrial temperature range and utilizes a compact form factor suitable for embedded applications requiring high processing density.

Feature Summary

  • Integrates Xilinx Zynq 7020 SoC with dual-core ARM Cortex-A9 processor
  • Includes 1 GB DDR3 SDRAM and 32 GB e.MMC non-volatile memory
  • Supports multiple communication protocols including Ethernet, USB 2.0, and JTAG
  • Designed for industrial environments with extended temperature specifications

Applications

  • Industrial automation controllers
  • Medical imaging systems
  • Automotive infotainment units
  • High-performance embedded computing platforms

Procurement Notes

This component is officially listed as End-of-Life (EOL) by the manufacturer. Availability is restricted or unavailable through standard distribution channels. Engineers should verify current stock status directly with authorized suppliers or consider alternative sourcing strategies due to discontinuation. Long-term supply agreements may be required for production continuity.

Selection Notes

Select this module when a compact solution combining ARM processing power with FPGA flexibility is required. It is suitable for designs needing integrated memory without external components. Verify that the specific interface requirements match the available pins on the SOM carrier board. Consider thermal management solutions appropriate for the enclosed system environment.

Part Context

Trenz Electronic specializes in modular computing systems based on Xilinx and Intel FPGAs. This module belongs to their portfolio of System-on-Modules designed for rugged and high-reliability applications. The company provides engineering support and carrier boards to facilitate integration into custom PCB designs for aerospace, defense, and industrial sectors.

Replacement Considerations

No direct public substitutes are confirmed for this specific discontinued part number. Designers should evaluate newer generations of Zynq-based modules from Trenz Electronic or other vendors offering similar pin-compatible or functionally equivalent SoM architectures. Migration requires re-evaluation of mechanical constraints and software compatibility.

TE0841-01-040-1ITE0841-01-040-1I

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