TE0841-02-035-1C

TE0841-02-035-1C

  • Description:SOM USCALE 2GB DDR4
  • Series:TE0841

SKU:832df7c42374 Category: Brand:

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Product Detailed Parameters

  • Description:SOM USCALE 2GB DDR4
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU035
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 70°C

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TE0841-02-035-1C

Overview

The TE0841-02-035-1C is a Kintex UltraScale FPGA micromodule integrating the XCKU035-1SFVA784C device. It features 2 GByte of 16-bit width DDR4 SDRAM and 64 MByte QSPI Flash for configuration. The module utilizes three Razor Beam connectors providing 260 terminals, including 56 HR user I/Os, 84 HP user I/Os, and eight GTH serial transceiver lanes. It operates within a commercial temperature range of 0°C to +70°C.

Feature Summary

  • Integrates Xilinx Kintex UltraScale KU35 FPGA with high-speed stacking connectors
  • Includes 2 GByte DDR4 memory and 64 MByte SPI boot flash on board
  • Supports single supply operation with onboard switch-mode power management
  • Features rugged industrial-grade design with standard 4 x 5 cm footprint

Applications

  • Industrial automation systems requiring programmable logic
  • High-speed data acquisition and processing modules
  • Telecommunications infrastructure equipment
  • Medical imaging signal processing units

Procurement Notes

This component is manufactured on demand rather than held in standard stock. Customers must contact the manufacturer or authorized distributors to inquire about specific minimum order quantities and current availability status before placing orders. Verification of the latest production lead times and pricing structures is required directly through official sales channels prior to procurement planning.

Selection Notes

Select this module when a compact 4 x 5 cm form factor is required alongside significant FPGA resources and integrated memory. Ensure the host carrier board supports the 260-terminal Razor Beam interface and provides adequate thermal management for the commercial temperature range. Verify that the Vivado Design Suite HLx Edition licenses meet the project's partial reconfiguration requirements.

Part Context

The TE0841 series represents Trenz Electronic's micromodule line designed for mechanical and electrical compatibility within the 4 x 5 cm standard. This specific variant targets applications needing the performance of the Kintex UltraScale family in a space-constrained environment, offering a drop-in replacement solution for other modules in the same physical footprint category.

Replacement Considerations

Modules within the TE0841 series sharing the 4 x 5 cm footprint offer mechanical compatibility. Electrical substitution requires verifying pinout alignment for the Razor Beam connectors and ensuring the target FPGA device supports the necessary I/O counts and memory interfaces present in the original design.

FAQ

What is the operating temperature range for this module?

The module is rated for a commercial temperature range of 0°C to +70°C. Actual operating limits depend on the customer's cooling solution and system design.

How many serial transceiver lanes are available?

The module provides eight GTH serial transceiver lanes accessible via the B2B connectors.

Does the module support single supply operation?

Yes, the module includes onboard switch-mode power supplies for all voltages, supporting single supply operation with user-defined IO-bank power settings.

TE0841-02-035-1CTE0841-02-035-1C

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