TE0841-02-035-1I

Overview

The TE0841-02-035-1I is a 4 x 5 cm FPGA micromodule integrating the Xilinx Kintex UltraScale KU035 (XCKU035-1SFVA784I) with 2 GByte of 16-bit width DDR4 SDRAM and 64 MByte SPI boot flash. It features rugged B2B connectors providing 260 terminals, including 56 HR user I/Os, 84 HP user I/Os, eight GTH serial transceiver lanes, and two GT clock inputs. The module operates within an industrial temperature range of -40°C to +85°C.

Feature Summary

• Integrates Xilinx Kintex UltraScale KU035 FPGA with onboard DDR4 memory and configuration flash
• Supports single supply operation with comprehensive on-board switch-mode power delivery
• Provides high-speed connectivity via three Razor Beam connectors with evenly spread supply pins for signal integrity

Applications

• Industrial automation systems requiring robust FPGA processing
• High-performance data acquisition and signal processing applications
• Embedded computing solutions in space-constrained enclosures

Procurement Notes

This component is manufactured on demand rather than held in standard stock. Customers must contact the manufacturer or authorized distributors directly to inquire about minimum order quantities and current availability status. Verification of the specific speed grade and package variant is recommended prior to procurement to ensure compatibility with existing design constraints.

Selection Notes

Select this module when a compact 4 x 5 cm form factor is required alongside significant programmable logic resources and high-speed memory interfaces. The integrated power management simplifies board design by supporting single-supply operation. Ensure the host carrier board supports the specific Razor Beam connector interface and provides adequate thermal management for the KU035 device within the specified industrial temperature range.

Part Context

The TE0841 series represents Trenz Electronic's micromodule line designed for mechanical and electrical compatibility within the 4 x 5 cm footprint. This specific part utilizes the Xilinx Kintex UltraScale architecture, positioning it between lower-density FPGAs and higher-end Virtex or Versal devices. It serves as a modular building block for custom embedded designs requiring scalable FPGA capabilities.

Replacement Considerations

Modules within the same 4 x 5 cm family offer mechanical compatibility. Verify electrical pinout alignment when substituting with other TE0841 variants. No direct cross-brand replacements are documented; redesign of the carrier board may be necessary if moving to different FPGA architectures or package types.

FAQ

What is the maximum operating temperature for this module?

The module is rated for an industrial temperature range of -40°C to +85°C. Actual operating limits depend on the customer's cooling solution and system design.

How many serial transceiver lanes are available on this module?

The module provides eight GTH serial transceiver lanes accessible through the B2B connectors.

Does the module require multiple power supplies?

No, the module includes on-board switch-mode power supplies and supports single-supply operation, though user-defined IO-bank power options are available.