TE0841-02-035-2I

TE0841-02-035-2I

  • Description:IC MODULE USCALE 2GB 64MB
  • Series:TE0841

SKU:3b366478d6d3 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE USCALE 2GB 64MB
  • Series:TE0841
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA Core
  • Core Processor:Kintex UltraScale KU035
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0841-02-035-2I

Overview

The TE0841-02-035-2I is a 4 x 5 cm micromodule integrating the Xilinx Kintex UltraScale XCKU035-2SFVA784I FPGA. It includes 2 GByte of 16-bit width DDR4 SDRAM and 64 MByte SPI Boot Flash. The module provides 260 terminals via three Razor Beam connectors, supporting 56 HR user I/Os, 84 HP user I/Os, eight GTH serial transceiver lanes, and two GT clock inputs. It operates within an industrial temperature range of -40°C to +85°C.

Feature Summary

  • Integrates Xilinx Kintex UltraScale KU035 FPGA with on-board 2 GByte DDR4 memory
  • Provides rugged high-speed stacking strips for extensive I/O expansion
  • Features integrated switch-mode power supplies supporting single supply operation
  • Includes Si5338 clocking solution with LVDS oscillator

Applications

  • Industrial automation systems requiring robust FPGA processing
  • Prototyping and development for medium-to-high-volume applications
  • Embedded solutions needing compact form factor with high performance
  • Data center infrastructure components

Procurement Notes

Verify that the specific ordering suffix corresponds to the required speed grade and package variant. Confirm mechanical compatibility with base boards using Razor Beam connectors. Ensure cooling solutions are adequate for the target operating environment, as thermal performance depends on customer design. Check for availability of reference designs and documentation from the manufacturer.

Selection Notes

Select this module when a compact 4 x 5 cm footprint is required alongside significant logic resources and high-speed memory. Consider the available I/O distribution across HR and HP banks for interface requirements. Evaluate the need for integrated power management versus external regulation. Compare against other modules in the series for mechanical and electrical compatibility if system scalability is a priority.

Part Context

This component belongs to Trenz Electronic's modular system portfolio, designed for embedded FPGA applications. It utilizes the AMD/Xilinx Kintex UltraScale family, balancing ASIC-class performance with power efficiency. The module is manufactured in Germany and supports various base board configurations for rapid deployment in industrial and commercial sectors.

Replacement Considerations

Modules within the same 4 x 5 cm form factor series offer mechanical and largely electrical compatibility. Verify pinout alignment and voltage levels when substituting with other variants in the TE0841 series or compatible families.

TE0841-02-035-2ITE0841-02-035-2I

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