TE0841-02-31I21-A

Overview

The TE0841-02-31I21-A is an industrial-grade system-on-module integrating a Xilinx Kintex UltraScale FPGA (XCKU035 or XCKU040) with 2 GByte of DDR4 SDRAM and 64 MByte QSPI Flash. It features three Samtec Razor Beam connectors providing 60 HR I/Os, 84 HP I/Os, and eight GTH transceiver lanes. The module operates on a single 3.3V supply, includes onboard power management, and supports an operating temperature range of -40°C to +85°C.

Feature Summary

• Integrates Xilinx Kintex UltraScale FPGA with high-speed GTH transceivers
• Includes 2 GByte DDR4 SDRAM and 64 MByte QSPI Flash for configuration
• Features rugged Samtec Razor Beam board-to-board interconnects
• Supports single 3.3V input with onboard switch-mode power supplies

Applications

• Industrial automation and control systems
• High-performance embedded computing platforms
• Data acquisition and signal processing applications
• Aerospace and defense electronics requiring rugged components

Procurement Notes

Verify the specific FPGA variant (XCKU035 or XCKU040) required for your design performance needs. Confirm that the carrier board utilizes compatible Samtec Razor Beam connectors with appropriate mating heights. Ensure the power supply provides stable 3.3V with sufficient current capability during startup. Check documentation for any PCB revision differences affecting clock generator programming.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA logic resources and high-speed serial connectivity. The inclusion of onboard memory and power regulation simplifies carrier board design compared to bare FPGA solutions. Consider the thermal requirements of the specific FPGA density chosen, as heat dissipation strategies may vary between the XCKU035 and XCKU040 variants in enclosed industrial enclosures.

Part Context

This part belongs to the Trenz Electronic TE0841 series of 4x5 cm system-on-modules. These modules are designed to be mechanically compatible within the family, allowing for easy upgrades or downgrades by swapping modules while retaining the same carrier board interface. The series targets developers needing rapid prototyping and production-ready industrial hardware based on Xilinx UltraScale technology.

Replacement Considerations

Direct replacements must match the mechanical footprint and connector pinout. Verify if the alternative module supports the same FPGA family or requires firmware adaptation. Check if the memory configuration and power requirements are identical to ensure carrier board compatibility without redesign.