TE0841-02-41I21-A

Overview

The TE0841-02 is a 4 x 5 cm industrial System-on-Module integrating a Xilinx Kintex UltraScale FPGA (XCKU035 or XCKU040), 2 GByte DDR4 SDRAM, and 64 MByte QSPI Flash. It features three Samtec Razor Beam connectors providing 60 HR I/Os, 84 HP I/Os, and eight GTH transceiver lanes. The module includes on-board power management, a programmable Si5338 clock generator, and an Lattice MachXO2 system controller CPLD for boot control and monitoring.

Feature Summary

• Integrates Xilinx Kintex UltraScale FPGA with dual-bank DDR4 memory
• Supports single 3.3V input via on-board switch-mode power supplies
• Includes Lattice MachXO2 CPLD for system configuration and JTAG forwarding
• Utilizes rugged Samtec Razor Beam high-speed board-to-board connectors

Applications

• Industrial automation controllers
• High-performance embedded processing systems
• Test and measurement instrumentation
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific FPGA variant (XCKU035 vs XCKU040) required for your design performance needs. Confirm the PCB revision level to ensure the programmable clock generator OTP area is pre-programmed, as older revisions may require manual configuration. Check carrier board compatibility regarding connector mating heights and voltage levels for I/O banks.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA logic resources and high-speed serial connectivity. The integrated DDR4 and QSPI reduce external component count. Ensure the carrier board can support the recommended 3.3V single-supply architecture and provides adequate thermal dissipation for the specified operating temperature range.

Part Context

Trenz Electronic manufactures the TE0841 series as a ready-to-use System-on-Module based on Xilinx silicon. This specific model represents the -02 variant, distinguished by its memory configuration and connector layout. These modules are designed to accelerate development cycles by abstracting complex PCB routing and power sequencing into a standardized, mechanically compatible package.

Replacement Considerations

No direct public substitutes are documented. Alternative solutions require redesigning the carrier board and validating FPGA pin compatibility manually.