TE0841-03-31C31-A

Overview

The TE0841-03-31C31-A is a System-on-Module manufactured by Trenz Electronic GmbH, integrating an AMD Zynq-7000 SoC. This module provides a compact solution for embedded applications requiring both programmable logic and dual-core ARM Cortex-A9 processing capabilities. It supports standard interfaces including Ethernet, JTAG, QSPI, and USB 2.0, facilitating integration into custom carrier designs.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual ARM Cortex-A9 processors
• Supports high-speed transceiver I/Os via rugged board-to-board connectors
• Includes onboard power delivery subsystem with multiple DC/DC converters and LDO regulators
• Features ultra-low jitter PLL for clock distribution to serial transceivers

Applications

• Industrial automation controllers
• Medical imaging systems
• Telecommunications infrastructure
• Test and measurement equipment

Procurement Notes

Verify component availability through authorized distributors as supply status may vary. Confirm technical specifications against the latest official datasheet before design finalization. Ensure compliance with regional regulatory standards such as CE or UKCA where applicable. Check for any product change notifications that might affect long-term procurement strategies.

Selection Notes

Select this module when a combined FPGA and processor solution is required in a small form factor. Consider the integrated memory options and interface availability relative to system requirements. Evaluate thermal management needs based on the specific operating environment and load conditions of the target application.

Part Context

This part belongs to the Trenz Electronic SOM family, designed to simplify the adoption of complex SoC technologies. It abstracts the critical PCB layout challenges associated with high-density BGA packages, allowing engineers to focus on system-level functionality rather than low-level hardware implementation details.

Replacement Considerations

No direct public substitutes are confirmed for this specific configuration. Alternative modules from the same manufacturer or other vendors should be evaluated based on pin compatibility, performance metrics, and software ecosystem support to ensure seamless migration.