SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TE0841-03-31I31-A is a System-on-Module manufactured by Trenz Electronic, integrating the AMD Zynq-7030 processor. It features an ARM Cortex-A9 dual-core architecture and includes 1 GB of DDR3L memory. The module operates within an industrial temperature range of -40°C to +85°C and utilizes the XC7Z030-1FBG676I chip. Its physical dimensions are 52 mm by 76 mm, designed for compact embedded applications requiring high processing power in a small form factor.
Verify component authenticity through authorized Trenz Electronic distributors or direct manufacturer channels. Confirm RoHS compliance status and specific revision levels prior to integration. Ensure supply chain stability as availability may fluctuate based on global semiconductor market conditions. Request official datasheets and mechanical drawings for accurate PCB footprint verification.
Select this module when a balance between processing performance and physical size is required. The Zynq-7030 provides sufficient logic resources for moderate complexity FPGA designs alongside dual-core processing. Consider the 1 GB DDR3L capacity for applications requiring substantial runtime memory. Verify interface compatibility with target baseboard connectors before final selection.
This module belongs to the Trenz Electronic SOM family, specifically tailored for Xilinx/AMD Zynq platforms. It serves as a complete computing solution, reducing design complexity by integrating the processor, memory, and essential peripherals into a standardized form factor. This approach accelerates time-to-market for embedded system developers.
Publicly confirmed direct substitutes are not available in the provided documentation. Engineers should evaluate other modules within the Trenz Electronic portfolio that utilize similar Zynq-7000 series processors but differ in memory configuration or I/O density. Cross-referencing pinouts and electrical specifications is essential when considering alternative vendors.