TE0841-03-32I31-A

TE0841-03-32I31-A

  • Description:IC MODULE USCALE 2GB
  • Series:-

SKU:4ac6d6283e51 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE USCALE 2GB
  • Series:-
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:-
  • Core Processor:-
  • Co-Processor:-
  • Speed:-
  • Flash Size:-
  • RAM Size:-
  • Connector Type:-
  • Size / Dimension:-
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TE0841-03-32I31-A

Overview

The TE0841-03-32I31-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded applications requiring high-performance processing. It integrates an AMD Zynq-7030 processor with dual ARM Cortex-A9 cores and programmable logic fabric. The module includes 1 GB of DDR3L memory and 64 MB of flash storage, operating within a temperature range of -40°C to +85°C. Its compact form factor measures 52 mm by 76 mm, facilitating integration into space-constrained industrial systems.

Feature Summary

  • Integrates AMD Zynq-7030 SoC combining ARM Cortex-A9 processors with FPGA fabric
  • Supports wide industrial operating temperatures from -40°C to +85°C
  • Includes onboard DDR3L SDRAM and non-volatile flash memory
  • Provides standard interfaces including I2C and JTAG for development and debugging

Applications

  • Industrial automation and control systems
  • Embedded data acquisition modules
  • High-precision measurement equipment
  • Custom embedded digital signal processing applications

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix indicates the intended commercial/industrial grade and memory configuration. Ensure compatibility with carrier boards supporting the 52 x 76 mm footprint and required power delivery specifications before procurement.

Selection Notes

Select this module when a combined CPU and FPGA solution is required in a compact industrial-rated package. The Zynq-7030 offers sufficient processing power for moderate complexity tasks while allowing hardware acceleration via the programmable logic. Consider the 1 GB DDR3L capacity for applications requiring significant runtime data buffering or complex OS execution.

Part Context

This component belongs to the TE0745 series of System-on-Modules from Trenz Electronic. These modules are part of the company's portfolio focused on providing robust, industrial-grade embedded solutions based on Xilinx and AMD FPGA technologies. The series is designed to simplify the integration of complex SoCs into custom carrier designs through standardized connectors and documented pinouts.

Replacement Considerations

No public confirmed substitutes are listed in the provided documentation. Engineers should evaluate other modules within the Trenz Electronic TE0745 family or comparable Zynq-7000 based SOMs from other manufacturers if this specific part becomes unavailable, ensuring pinout and electrical compatibility.

TE0841-03-32I31-ATE0841-03-32I31-A

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